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Method for manufacturing circuit board

A circuit board, electrical connection technology, applied in the direction of laminated printed circuit board, printed circuit, multi-layer circuit manufacturing, etc., can solve the problems of reduced precision of thin circuit boards, difficult to control the size of thin circuit boards, etc.

Inactive Publication Date: 2004-09-01
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to control the size of the thin circuit board, so that the precision of the thin circuit board on which high-density wiring patterns will be formed must be reduced

Method used

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  • Method for manufacturing circuit board
  • Method for manufacturing circuit board
  • Method for manufacturing circuit board

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Experimental program
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Embodiment Construction

[0029] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0030] Figure 1A -1C is a schematic diagram showing the method of manufacturing a circuit board of the present invention. Figure 1A Shows the characteristic steps of the present invention, in which the first metal layer 41 and the second metal layer 42 are attached to the two surfaces of the core substrate 10, which includes the core component 10a and two adhesive films attached to the core component 10a. A copper film 11 on the surface.

[0031] In order to ensure the processing and transfer of the core substrate 10, the core substrate 10 has sufficient robustness. In addition, the core substrate 10 has sufficient toughness to avoid deformation caused by the stress generated when the insulating layer and the plating layer are formed on the core substrate 10. In this embodiment, the core component 10a is an epoxy resin sheet with a thickn...

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Abstract

The method of manufacturing a circuit board is capable of preventing deformation of a core substrate, ensuring size thereof and highly concentrating cable pattern so as to realize compact and high-performance semiconductor devices. The method of manufacturing a circuit board of the present invention comprises the steps of: forming a multilayered body, in which cable patterns on different layers insulated by an insulating layer are electrically connected, on a core substrate by a buildup process; and separating the multilayered body from the core substrate. A metal layer is vacuum-adhered on the core substrate. The multilayered body is formed on the metal layer by the buildup process and separated from the core substrate together with the metal layer by breaking the vacuum state between the core layer and the metal layer.

Description

Technical field [0001] The present invention relates to a method of manufacturing a circuit board, in particular to a thin circuit board that can form wiring patterns in a high concentration. Background technique [0002] Hereinafter, a conventional method of manufacturing a printed circuit board will be described with reference to FIGS. 8A-9D, in which a multilayer wiring pattern is formed on both sides of a core substrate by a build process. [0003] 8A-8F show the steps of forming a core part in which wiring patterns are superimposed on both surfaces. In FIG. 8A, the copper film 11 is attached to the core substrate 10. The core substrate 10 includes a core component 10a, which is made of epoxy resin containing glass fibers and a copper film 11 covering an upper surface and a lower surface of the core component 10a, respectively. [0004] In FIG. 8B, a through hole 12 is formed in the core substrate 10 by drilling. The inner diameter of each through hole 12 is approximately 250...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/46
CPCH05K2203/085H05K3/0058H05K2203/0156H05K2203/1536H05K2203/0152H05K3/4682Y10T29/49117Y10T29/49126Y10T29/4913
Inventor 首藤贵志柏武文高野宪治饭田宪司阿部健一郎
Owner FUJITSU LTD