Air floation XY coordinates plane movoment platform

A coordinate plane and motion platform technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as frictional resistance that is difficult to increase acceleration, heat deformation of the motion platform, and affecting positioning accuracy, etc., to achieve structural rigidity, High positioning accuracy and reduced motion inertia
CN1564317AInactive Publication Date: 2005-01-12SHANGHAI JIAO TONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHANGHAI JIAO TONG UNIV
Publication Date
2005-01-12
Estimated Expiration
Not applicable · inactive patent

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Abstract

The motion platform is composed of two linear motors perpendicular to each other, three platforms, two groups of position limited optical coupler and initial point optical coupler and two groups of optical grating ruler. Working platform, intermediate platform and lower platform are piled and connected to base. Platforms are connected through air floating guides. Intermediate platform and lower platform are movable in X direction relatively; working platform and intermediate platform are movable in Y direction relatively. Working platform and linear motors are connected through linear motor. Two linear motors drive motions of working platform along X and Y directions respectively. Stators of motor are fixed on base so as to reduce movement inertia. The invention is suitable to working platform in XY coordinate plane at high speed, high acceleration and precision.
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Description

technical field

[0001] The invention relates to an air-floating XY two-coordinate plane motion platform, which can be used for precise positioning of IC chip packages in microelectronics manufacturing, and belongs to the field of transmission mechanisms. Background technique

[0002] In industrial control, high-speed and high-precision motion control, as a general technology in the fields of manufacturing and assembly, has always been an important research content in industry and academia, especially in the field of microelectronics manufacturing of chip (IC) packaging. The technical level of the typical motion platform of the current packaging equipment is: the motion acceleration is 6-10g, the positioning accuracy is 5-10μm, and the frequency bandwidth is 200-300Hz. With the development of science and technology, the size of chip packaging is continuously reduced, the density of I / O is increasing, and the packaging process materials are improved, which put forward higher r...

Claims

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