Direct-driving three-freedom serial-parallel mixed precision positioning mechanism
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- HARBIN INST OF TECH
- Publication Date
- 2005-02-16
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
Technical field:
[0001] The invention relates to a novel precision positioning mechanism. Background technique:
[0002] At present, with the rapid development of industries involving the interconnection of tiny devices (dimensions or pitches on the micron level) such as integrated circuits (ICs) and micro-electromechanical systems (MEMS), higher interconnection technologies such as wire bonding (Wire Bonding) have been proposed. requirements. It is required to further improve the motion accuracy, speed and acceleration of such systems, so as to further improve the integration, manufacturing quality and production efficiency of microsystems and microdevices such as IC and MEMS. Existing systems of this type, such as die bonders and wire bonders, use two degrees of freedom in the form of a motor-screw-nut mechanism, a horizontal movement table in the form of a rectangular coordinate, and a vertical movement in the form of a rotary movement. workbench. This type of device h...