Direct-driving three-freedom serial-parallel mixed precision positioning mechanism

A technology of precise positioning and degrees of freedom, which is applied to the parts and instruments of the instrument, and can solve the problems of long stabilization time, increased motion inertia, unfavorable mechanism motion speed and acceleration, etc.
CN1581362AInactive Publication Date: 2005-02-16HARBIN INST OF TECH

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HARBIN INST OF TECH
Publication Date
2005-02-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

The positioning mechanism includes following parts ad connections: bent plate is fixed on a side of machine foundation, base of No.1 motor and base of No.2 motor are fixed on the foundation; one end of No.1 connecting rod is hinge-jointed to bent plate, and another end of No.1 connecting rod is connected to one end of No.3 and No.4 connecting rods respectively; one end of No.2 connecting rod is hinge-jointed to output end of No.1 motor, another ends of No.3 and No.2 connecting rods are hinge-jointed to output module from upper to lower respectively. The invention also contains No.5 connecting rod, and other connections etc. Rectilinear motion module is fixed to output module. Advantages are: compact structure, high positioning accuracy, and good dynamic performance.
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Description

Technical field:

[0001] The invention relates to a novel precision positioning mechanism. Background technique:

[0002] At present, with the rapid development of industries involving the interconnection of tiny devices (dimensions or pitches on the micron level) such as integrated circuits (ICs) and micro-electromechanical systems (MEMS), higher interconnection technologies such as wire bonding (Wire Bonding) have been proposed. requirements. It is required to further improve the motion accuracy, speed and acceleration of such systems, so as to further improve the integration, manufacturing quality and production efficiency of microsystems and microdevices such as IC and MEMS. Existing systems of this type, such as die bonders and wire bonders, use two degrees of freedom in the form of a motor-screw-nut mechanism, a horizontal movement table in the form of a rectangular coordinate, and a vertical movement in the form of a rotary movement. workbench. This type of device h...

Claims

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