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Laser beam machine

A laser processing and machine tool technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as impossible laser beam processing, laser beam focal point misalignment, etc.

Inactive Publication Date: 2005-03-23
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, thermal expansion problems of the concentrator housing lead to misalignment of the focus point of the applied laser beam, thus making it impossible to perform laser beam processing stably

Method used

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  • Laser beam machine
  • Laser beam machine
  • Laser beam machine

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Embodiment Construction

[0018] According to a preferred embodiment of the present invention, a laser processing machine tool will be described in detail below with reference to the accompanying drawings.

[0019] Fig. 1 is the perspective view of a laser processing machine tool that constitutes according to the present invention; The laser processing machine tool shown in Fig. 1 comprises a fixed base 2, a chuck table mechanism 3, a laser beam applying unit supporting mechanism 4 and a laser beam Beam application unit 5 . The chuck table mechanism 3 is installed on the fixed base 2 in a manner capable of moving in the direction indicated by the arrow X, and is used to clamp the workpiece; the supporting mechanism 4 of the laser beam applying unit is installed in the manner capable of moving in the direction indicated by the arrow Y On the fixed base 2, the direction indicated by the arrow Y is perpendicular to the direction indicated by the arrow X; the laser beam application unit 5 is mounted on the...

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Abstract

A laser beam machine comprising a workpiece holding means for holding a workpiece, a laser beam application means comprising a condenser for applying a laser beam to the workpiece held on the workpiece holding means, and a focusing point position adjusting means for adjusting the position of the focusing point of the laser beam applied by the condenser, wherein the machine further comprises a temperature detection means for detecting a temperature of the condenser and a control means for controlling the focusing point position adjusting means based on the temperature of the condenser detected by the temperature detection means.

Description

technical field [0001] The invention relates to a laser processing machine tool for processing workpieces, such as semiconductor wafers. Background technique [0002] In the manufacturing process of semiconductor devices, on the front surface of a substantially disc-shaped semiconductor wafer, the boundary lines called "blocks" arranged in a lattice pattern divide the semiconductor wafer into many regions, and a Circuits, such as integrated circuits (ICs), large scale integrations (LSIs), etc. Individual semiconductor chips are made by dicing the semiconductor wafer along the street, dividing it into circuit template areas. An optical device wafer having a gallium nitride insulating semiconductor laminated on the front surface of a sapphire substrate is also separated into individual optical devices such as light-emitting diodes or laser diodes widely used in electrical devices along the dividing line. [0003] The dicing along the streets of semiconductor wafers or optica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
CPCB23K26/04
Inventor 永井祐介小林贤史森重幸雄重松孝一
Owner DISCO CORP