Substrate delivery in-out device, method and substrate delivery appts. and method

A technology of conveying device and substrate processing device, which is applied in the direction of conveyor objects, transportation and packaging, lighting and heating equipment, etc., which can solve the problems of large-scale clean room and large installation space, and achieve the effect of structural simplification

Inactive Publication Date: 2005-03-30
SHINKO ELECTRIC CO LTD
View PDF4 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem of increasing the size of the clean room that accommodates each device
In particular, in the substrate transfer device that moves on the moving track, the substr

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate delivery in-out device, method and substrate delivery appts. and method
  • Substrate delivery in-out device, method and substrate delivery appts. and method
  • Substrate delivery in-out device, method and substrate delivery appts. and method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0070] Below, refer to Figures 1 to Picture 10 The first embodiment of the substrate carry-in and carry-out apparatus of the present invention will be described.

[0071] As shown in FIG. 1, the substrate carry-in and carry-out apparatus 1 of this embodiment accesses the substrate A in a wire cage (storage container) 10 that stores a plurality of substrates A. The wire cage 10 is provided with a plurality of substrate support portions 2 arranged at intervals in the vertical direction and horizontally placed the thin-plate-shaped substrates A, 2 are provided on the side, and carry in and out of the substrate A in the horizontal direction. 3 and a lower opening 4 provided in the lower part.

[0072] Wire cage 10, such as Figure 2 to Figure 5 As shown, a frame 5 made of metal such as aluminum is formed into a box shape, and a vertical frame 5a is provided on the side other than the above-mentioned carry-in / out port 3. On the upper and lower sides, racks arranged in a direction perpe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

An installation/removal device (1) for putting or removing a substrate (A) into or from a storage container (10) in which substrates are stored, the installation/removal device comprising a mounting table (31) on which the substrate (A) is mounted, a holder (32) for holding the substrate (A) provided on the mounting table (31) so as to be movable in the direction of installation/removal of the substrate (A), and rollers (37) provided on the mounting table which support the substrate (A), being held by the holder (32), such that it is movable in the direction of installation/removal.

Description

technical field [0001] The present invention relates to a substrate loading and unloading device and a substrate loading and unloading method for loading and unloading plate-shaped substrates such as semiconductor substrates and liquid crystal substrates from or into storage containers, The aforementioned substrate transfer apparatus and substrate transfer method for transferring a substrate to a processing apparatus or the like. [0002] This application claims the priority of Japanese Patent Application No. 2003-296453 and Japanese Patent Application No. 2003-296454 filed on August 20, 2003, and the contents thereof are incorporated herein. Background technique [0003] At present, in the manufacturing process of substrates such as semiconductors, a plurality of substrates are stored in a storage container, and are carried out from the storage container by a substrate loading and unloading device and sent to a substrate transferring device, and are transferred by the subst...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/68B65G49/00
CPCH01L21/67706H01L21/67742H01L21/6779H01L21/6838
Inventor 北泽保良
Owner SHINKO ELECTRIC CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products