Substrate delivery in-out device, method and substrate delivery appts. and method
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- SHINKO ELECTRIC CO LTD
- Publication Date
- 2005-03-30
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to a substrate loading and unloading device and a substrate loading and unloading method for loading and unloading plate-shaped substrates such as semiconductor substrates and liquid crystal substrates from or into storage containers, The aforementioned substrate transfer apparatus and substrate transfer method for transferring a substrate to a processing apparatus or the like.
[0002] This application claims the priority of Japanese Patent Application No. 2003-296453 and Japanese Patent Application No. 2003-296454 filed on August 20, 2003, and the contents thereof are incorporated herein. Background technique
[0003] At present, in the manufacturing process of substrates such as semiconductors, a plurality of substrates are stored in a storage container, and are carried out from the storage container by a substrate loading and unloading device and sent to a substrate transferring device, and are transferred by the subst...