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Wafer positioning method and apparatus, processing system, and method for positioning wafer seat rotating axis of wafer positioning apparatus

A technology of positioning device and positioning method, which is applied to measurement devices, optical devices, instruments, etc., can solve problems such as low positioning accuracy, and achieve the effects of high wafer positioning, high precision, and shortening operation time.

Inactive Publication Date: 2005-05-04
RORZE CORP
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

If the eccentricity is within tolerance, the wafer positioning operation continues but maintains this eccentricity, often resulting in lower positioning accuracy

Method used

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  • Wafer positioning method and apparatus, processing system, and method for positioning wafer seat rotating axis of wafer positioning apparatus
  • Wafer positioning method and apparatus, processing system, and method for positioning wafer seat rotating axis of wafer positioning apparatus
  • Wafer positioning method and apparatus, processing system, and method for positioning wafer seat rotating axis of wafer positioning apparatus

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Embodiment Construction

[0087] Hereinafter, an embodiment of the present invention will be described in detail by way of example based on the drawings. figure 1 is a perspective view, partially in section, of a wafer processing system including an embodiment of the wafer positioning apparatus of the present invention utilizing an embodiment of the wafer processing method of the present invention. Such as figure 1 As shown, the wafer positioning apparatus 1 is placed next to a conventional wafer transfer apparatus 40 constituted by an industrial robot or the like and a conventional wafer processing apparatus 30 for performing etching processing etc. on a wafer. The wafer positioning device 1 , the wafer transfer device 40 and the wafer processing device 30 constitute a wafer processing system 50 , which is an embodiment of the wafer processing system of the present invention. When the wafer 21 is transferred to the wafer processing device 30 by the wafer transfer device 40 from the wafer cassette 20 ...

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Abstract

In wafer positioning by moving a center point (0) of a wafer (21) to a given position and orienting a notch part (21a) of the wafer in a given direction, wafer seat drive means (2,3,8, or 9) positions a rotation axis (B) of a wafer seat (16) on a straight line which passes through a center part of a line sensor (4) and extends in the extending direction thereof, and rotates the wafer seat on which the wafer lies around the rotation axis; calculation means (24) finds a wafer notch part position and a maximum or minimum eccentric radius of the wafer based on a rotation angle of the wafer seat and detection results of an outer periphery edge of the wafer lying on the wafer seat by the line sensor, and, from the obtained results, geometrically calculates a rotation axis position and a rotation angle of the wafer when the wafer center point is at the given position and the wafer notch part is oriented in the given direction; and the wafer seat drive means (2, 3, 8, or 9) moves, rotates, and stops the wafer seat (16) so that a rotation axis position and a rotation angle of the wafer seat correspond to the calculated rotation axis position and the calculated rotation angle. In result, speed and precision in a wafer positioning operation can be thereby improved.

Description

technical field [0001] The present invention relates to a wafer positioning method, which is used in a preparatory stage such as inspection, processing or transfer process of a semiconductor wafer, and which accurately positions the wafer in a given direction and a given position; the present invention also relates to the use of the method A wafer positioning device; and a wafer processing system comprising the wafer positioning device and using the above method. [0002] The invention also relates to a method for positioning the axis of rotation of a wafer holder on a line passing through the central portion of the line sensor and extending in the direction of its extension, as a preparatory step for a positioning device for semiconductor The preparatory stage of wafer inspection, processing or transfer process, etc., and accurately position the wafer in a given direction and a given position; the invention also relates to a wafer positioning device using this method. Backg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68
CPCH01L21/68H01L21/681H01L21/682
Inventor 福崎义树新宅朝之
Owner RORZE CORP
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