Circuit film for micro electromechanical probe and fabricating method thereof

Abstract

This invention relates to a micro electro-mechanical prove circuit film and its process method. The film is made of applicable semi-conductive process and integrates the probe, electron circuit, circuit joints and probe carrier and dielectric layer into one flexible and multi-layer structure. The structure is characterized by comprising electron circuit in the dielectric layer inner part to form multi-layer circuit distribution; the probe and circuit joints are imbedded between the dielectric layer and electron circuit with their ends protrude to the outside of the thin film to avoid the huge pressure on the probe.

Description

technical field [0001] The invention relates to a micro-electromechanical probe circuit film and its manufacturing method, especially to integrate probes, electronic circuits, circuit joints, probe carriers and dielectric layers together to form a flexible film using semiconductor manufacturing processes. And it is a micro-electromechanical probe circuit film with an integrated multi-layer film structure. Background technique [0002] With the rapid growth of semiconductor technology, many consumer electronic products are getting smaller and smaller, the density of integrated circuits and related components is relatively increased, and the number of pins is increased and the spacing is reduced. In addition, the improvement of packaging technology makes the layout of circuit contacts on the surface of integrated circuits , It is no longer just arranged on the periphery of the integrated circuit, but arranged in a matrix; at the same time, the material of the circuit contacts ...

AI Technical Summary

Problems solved by technology

[0007] The probe 21 of this thin film test card 20 is only attached to the surface of the flexible circuit soft board 28 by its bottom, and there is no covering protection structure around the probe 21 to strengthen the structural strength of the probe 21, so this thin film test The structure of the probe 21 of the card 20 is quite unstable in fact, once the probe 21 is under pressure, such as figure 1 As shown in Figure b, the probe 21 is prone to skewing or sinking, which will cause distortion of test results

[0008] On the other hand, after the probe 21 of this thin film test card 20 is made, it must be assembled on other bearing mechanisms usually, but because the circuit board 28 is a flexible object, and the back side of the circuit board 28 is oppositely provided with The area of ​​the probe 21 is not elevated to increase the thickness or has a fixing mechanism, so that the probe 21 is prone to be skewed and uneven due to the bending of the circuit board 28, such as figure 1 As shown in Figure c, this defect will increase the difficulty of assembling this thin film test card 20

[0009] Because the structure of the probes 21 of this film test card 20 has the above-mentioned defects, it is not easy to be arranged in a matrix, so the test use of this film test card 20 is limited, and it is usually only suitable for testing circuit contact pads that are arranged on ICs. surrounding product or panel

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