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Grinding liquid reusing device and system thereof

A technology of grinding fluid and grinding process, applied in grinding/polishing equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of inconvenient operation, affecting production capacity, waste of resources, etc.

Inactive Publication Date: 2005-07-06
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the inconvenient operation caused by cleaning the grinding liquid during PM operation will also prolong the time of PM operation and affect the production capacity; in addition, in actual use, the filtered grinding liquid can be reused but cleared to a certain extent waste of resources; most importantly, the meaning of the other side of clearing the available grinding fluid is that it cannot meet the environmental protection requirements of the green process

Method used

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  • Grinding liquid reusing device and system thereof
  • Grinding liquid reusing device and system thereof
  • Grinding liquid reusing device and system thereof

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Embodiment Construction

[0025] Please refer to figure 2 As shown, the present invention provides a polishing liquid recycling system 1 applied to a chemical mechanical polishing process. The system includes a polishing liquid circulation pipeline 2, at least one polishing liquid supply unit 3 connected to the polishing liquid circulation pipeline 2, and several A polishing liquid recycling device 4 connected to the polishing liquid circulation pipeline 2 and a plurality of chemical mechanical polishing units 5 respectively connected to the polishing liquid recycling device 4.

[0026] In the chemical mechanical polishing process of the present invention, the polishing liquid supply unit 3 is used to provide an abrasive slurry containing abrasive particles, and the slurry is injected into the polishing liquid circulation pipeline 2, and the polishing liquid can be transported at most through the polishing liquid circulation pipeline 2 One of the chemical mechanical grinding unit 5 (eg, chemical mechanica...

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Abstract

This invention relates to a grinding recycle device and its system used in chemical and mechanic grinding process. The system comprises the following: grinding recycle pipes; at least one grinding liquid supply unit form the pipes; several grinding liquid recycle device connected to the grinding recycle pipes; several chemistry mechanic grinding units separately connected to the grinding liquid. The device comprises the recycled and filtered grind liquid recycle pump, waste liquid exhausted and drainage unit for waste gas.

Description

Technical field [0001] The invention relates to a polishing liquid reuse device and its system, in particular to a polishing liquid reuse device and its system applied to a chemical mechanical polishing process. Background technique [0002] With the reduction of the line width of semiconductor devices and the increase of the number of layers, the planarization process has become indispensable. Chemical Machine Polishing (CMP) is the main technology of the current planarization process, which uses polishing pads and polishing liquids to perform the planarization process. The dual polishing of mechanical removal and chemical erosion removes substances on the surface of the wafer, which can make the surface of the product to be flattened in a comprehensive manner to facilitate the subsequent film deposition. [0003] The well-known chemical mechanical grinding process also includes a filtering unit, which filters the grinding liquid before the chemical mechanical grinding unit to f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B57/00
Inventor 王仁杰郑宗淦
Owner SEMICON MFG INT (SHANGHAI) CORP
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