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Control apparatus and method for preventing wafer from breaking

A control device and chip technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, semiconductor/solid-state device testing/measurement, etc., can solve the problems of low liquid level in outer tank 12, failure or no adjustment, etc., to solve the problem of fragmentation effect of the problem

Active Publication Date: 2005-07-27
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the pipeline or valve leaks, the joint is loose, or there is a crack in the outer tank 12, etc., it will cause the liquid level in the outer tank 12 to be too low, usually the liquid level sensor (not shown in the figure) will alarm, but if the liquid level If the sensor fails or is not adjusted properly, the circulation loop 62 will draw air into the circulation loop 62 when the phosphoric acid mixture 74 is circulated, and the air will also become air bubbles in the circulation loop 62, resulting in the above mentioned Floats and Fragments

Method used

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  • Control apparatus and method for preventing wafer from breaking
  • Control apparatus and method for preventing wafer from breaking
  • Control apparatus and method for preventing wafer from breaking

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Embodiment Construction

[0043] The present invention provides a new control system to prevent chip fragments caused by floating chips. Please refer to Figure 4 , which shows a schematic cross-sectional view according to a preferred embodiment of the present invention.

[0044] exist figure 1 Among them, a closed but not completely sealed acid tank 20 includes an inner tank 10 and an outer tank 12 . The inner tank 10 is where the reaction takes place, through a rear circulation loop 62 so that the phosphoric acid mixture 74 can be recycled during wet etching; while the outer tank 12 is provided with a supply pipe 30 for the deionization required for the reaction water 72.

[0045] The working temperature in the acid tank 20 is 160 degrees Celsius. When the phosphoric acid 70 has not reached 90 degrees Celsius, the phosphoric acid 70 will circulate along the circulation loop 60; and when its temperature exceeds 90 degrees Celsius, it will change to the circulation loop 62 cycle. Circulation loop ...

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Abstract

A control device for wafer broken prevention comprises at least a bubble detect sensor and a PLC(programmable logical controller). The bubble detect sensor can calculate the number of bubbles in circulation loop and detect air-sucking in circulation loop. The PLC can analyze the on / off signal from the bubble detect sensor and design alarm parameter. Accordingly adding the device, people can prevent wafer from floating and breaking by observing bubbles and air-sucking condition in circulation loop.

Description

technical field [0001] The present invention relates to a control device and method for preventing chip breakage, and in particular to a control device and method for preventing chip breakage used in wet etching. Background technique [0002] The function of the etching process is to physically or chemically remove the part of the film deposited before the photolithography process that is not protected and covered by the photoresist, so as to complete the transfer of the photomask pattern onto the film. There are two main types of etching techniques widely used in semiconductors: one is wet etching (Wet Etching); the other is dry etching (Dry Etching). The former method mainly uses chemical reactions to etch thin films, while the latter uses physical effects. [0003] Among them, wet etching is the earliest etching technology used. It uses the chemical reaction between the film and a specific solution to remove the film not covered by the photoresist, that is, to remove a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
CPCH01L21/67253H01L21/67086
Inventor 曾文松吕国良
Owner TAIWAN SEMICON MFG CO LTD