Integrated circuit device

一种集成电路、器件的技术,应用在集成电路器件领域,能够解决升高温度、环境温度不均匀、电阻器内部温度不均匀等问题,达到环境温度均匀、精确和稳定测量温度的效果

Inactive Publication Date: 2005-10-05
RENESAS ELECTRONICS CORP
View PDF0 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, when forming a resistor composed of vanadium oxide and measuring the temperature of an integrated circuit device by measuring the resistance of the resistor, the ambient temperature of the resistor may not be uniform due to the influence of the internal and external environments of the integrated circuit device
For example, the current flow of wiring etc. around the resistor locally raises the temperature, thus making the ambient temperature uneven
In this case, the internal temperature of the resistor becomes non-uniform, thus making the internal resistivity of the resistor non-uniform, with the result that the temperature cannot be measured accurately or stably

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integrated circuit device
  • Integrated circuit device
  • Integrated circuit device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings. First, the first embodiment of the present invention will be described. figure 1 is a plan view showing a semiconductor integrated circuit device according to a first embodiment of the present invention, figure 2 for along figure 1 the cross section of the line A-A' shown, and image 3 For the equivalent circuit diagram, the figure 1 with figure 2 Shown is the temperature sensor portion of the semiconductor integrated circuit device. The semiconductor integrated circuit device according to the present embodiment is formed on a single silicon chip.

[0024] Such as figure 1 with 2 As shown, the semiconductor integrated circuit device 1 according to the present embodiment has, for example, a P-type silicon substrate 2 on which a multilayer wiring structure 3 is provided. The multilayer wiring layer 3 includes a plurality of wiring ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
electrical resistivityaaaaaaaaaa
Login to view more

Abstract

In a semiconductor integrated circuit device, a sheet-like temperature monitor member of vanadium oxide is provided, whose one end is connected to one via while the other end is connected to another via. A sheet-like thermal conducting layer of aluminum is provided below the temperature monitor member. A region equal to or greater than a half of the entire temperature monitor member overlies the thermal conducting layer in a plan view.

Description

field of invention [0001] The invention relates to an integrated circuit device with a built-in monolithic temperature sensor. Background technique [0002] Recently, there has been an increasing need to monitor the operating temperature of integrated circuit devices in order to prevent thermal breakdown of devices in integrated circuit devices and to stabilize the operation of devices having temperature-dependent characteristics. [0003] In this regard, for example, Japanese Patent Laid-Open Publication H1-302849 discloses a technique of providing a temperature sensor on the same substrate as that of an LSI (Large Scale Integration). In this technique, a temperature sensor determines whether the LSI is abnormally overheated when the temperature detected by the temperature sensor exceeds a predetermined value, and then turns off the LSI. Therefore, the LSI can be protected from thermal breakdown due to temperature rise. Japanese Patent Laid-Open Publication No. H9-229778 ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/52G01K7/16H01L21/3205H01L21/822H01L23/34H01L23/522H01L23/58H01L27/00H01L27/04H01L31/058
CPCH01L23/522G01K7/16H01L2924/0002H01L23/34H01L2924/00
Inventor 大窪宏明中柴康隆川原尚由村濑宽小田直树佐佐木得人伊藤信和
Owner RENESAS ELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products