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Heat sink and method for processing surfaces thereof

A heat sink and heat sink technology, applied in nanotechnology for materials and surface science, electrical digital data processing, digital data processing parts, etc., can solve the problem of not being able to improve the diffuse reflectance of oxide film 16 and increase the size , space constraints, etc.

Inactive Publication Date: 2005-11-09
LG ELECTRONICS INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, since the diffuse reflectance of the oxide film 16 cannot be improved by the prior art, the volume of the heat sink 10 must be increased or, as the fins 14 are densely formed on the base, the heat exchange area of ​​the heat sink 10 must be increased. increased to improve heat dissipation of the heatsink
Therefore, the disadvantage of the prior art heat sink is that its size is increased and the space for installing the cooling fins 14 in high density is limited.

Method used

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  • Heat sink and method for processing surfaces thereof
  • Heat sink and method for processing surfaces thereof
  • Heat sink and method for processing surfaces thereof

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Embodiment Construction

[0029] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0030] The heat sink and the method of treating the surface of the heat sink according to the invention can be changed in various modifications. Preferred embodiments of the present invention will be described in detail below. Since the basic structure of the radiator of the present invention is the same as that of the prior art, a detailed description thereof will be omitted below.

[0031] image 3 is a cross-sectional view of a heat sink according to the present invention.

[0032] Such as image 3 As shown, heat sink 50 includes a base 52 , which is attached to the heat generating element; and at least one or more cooling fins 54 , which extend upwardly from base 52 . In particular, the base 52 or the heat sink 54 has a plurality of thin lines uniformly formed on the surface so that the surface area or surface roughness can be increased...

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Abstract

A heat sink and a method for processing the surfaces of the heat sink are disclosed. The heat sink and a method for processing the surfaces of the heat sink can improve performance of heat dissipation of the heat sink per volume as a plurality of fine wires (56) based on nanometer or micrometer units are grown on the surfaces of the base (52) and heat-dissipative fins (54) of the heat sink through oxidation process. Here, the total volume of the heat sink is scarcely increased, but rather their surface area and surface roughness are increased.

Description

technical field [0001] The present invention relates to a heat sink that dissipates heat from a heat generating element, particularly a heat sink having a plurality of fine wires grown on its surface capable of dissipating heat from the heat generating element, and a method of treating the surface of such a heat sink. Background technique [0002] figure 1 is a perspective view of a prior art radiator. figure 2 is a cross-sectional view of a prior art radiator. [0003] Such as figure 1 with 2 As shown, the heat sink 10 of the prior art is installed on the heating element 4 of the power supply module, CPU (central processing unit), power transistor, etc. installed on the PCB (printed circuit board) 2, to dissipate the heat generated from them, to prevent Thermal aging of the heating element 4. [0004] The heat sink 10 includes: a base 12 attached to the heating element 4; a plurality of cooling fins 14 extending upward from the base 12 and evenly spaced from each othe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L21/48H01L23/367H05K7/20
CPCH01L2924/0002H01L21/4882H01L23/3677H01L2924/00H05K7/20B82Y30/00
Inventor 安光协郑文基李延镐柳湖善金钟勋
Owner LG ELECTRONICS INC