Pipe surface ceramizing treatment process

A treatment process and ceramization technology, which is applied in the field of ceramization treatment process on the surface of pipe fittings, can solve the problems of large thermal influence of the substrate, difficult process, difficult post-processing of the ceramic coating, etc., to achieve uniform high temperature resistance, convenient use, temperature and concentration. Basically constant effect

Inactive Publication Date: 2005-12-14
INST OF PHYSICS - CHINESE ACAD OF SCI
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  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, plasma spraying ceramics, laser cladding ceramics and vapor deposition ceramics technologies have been applied in some fields, but some of the ceramic coatings obtained by these technologies are not easy to be post-processed, and some processing processes have a great influence on the heat of the substrate. Some of them are difficult to be popularized on a large scale due to the high cost; and for the ceramicization of the inner surface of the pipe fittings, these ceramicization methods all have technical difficulties

Method used

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  • Pipe surface ceramizing treatment process
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Examples

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Effect test

Embodiment 1

[0026] Example 1: First, hot-dip aluminizing the inner and outer surfaces of 45# steel pipe fitting 2 with an inner diameter of Φ50 mm, immerse the 45# steel pipe fitting 2 in molten aluminum, and control the temperature of the molten aluminum at 690-710°C, and heat-dip the 45# steel pipe Part 2 rotates and moves up and down, and the hot-dip aluminum plating time is about 20 minutes, forming a 75μm Fe-Al alloy layer and an 80μm pure aluminum layer on the surface of the pipe;

[0027] Then, if figure 2 As shown, the full immersion method is used to vertically fix the 45# steel pipe fitting 2 that has been hot dipped and aluminized, and then immerse it in the treatment liquid in the treatment tank as a whole, place the electrode rod 1 in the center of the inner cavity of the pipe fitting 2, and then put the electrode rod 1 is connected to the negative pole of the pulsed DC power supply 3, and the tube 2 is connected to the positive pole of the pulsed DC power supply 3, and the ...

Embodiment 2

[0029] Embodiment 2: First, the method of PVD is used to pre-deposit a magnesium layer with a thickness of about 50 μm on the inner and outer surfaces of polyvinyl chloride pipe fittings 2 with an inner diameter of Φ50 mm, and then, as figure 2 As shown, using the full immersion method, the PVC pipe fitting 2 prepared with a magnesium valve metal layer is vertically fixed and immersed in the treatment solution in the treatment tank as a whole, the electrode rod 1 is placed in the center of the inner cavity of the pipe fitting 2, and then the electrode Rod 1 is connected to the negative pole of the pulsed DC power supply 3, and the PVC pipe fitting 2 prepared with a magnesium valve metal layer is connected to the positive pole of the pulsed DC power supply 3, and a voltage is applied to the pipe fitting 2 through the pulsed DC power supply 3, and the voltage value is gradually adjusted to maintain a constant current density 0.02A / cm 2 The processing time is 30 to 50 minutes. U...

Embodiment 3

[0031] Embodiment 3: First, hot-dip aluminizing is performed on the inner and outer surfaces of the copper pipe fitting 2 with an inner diameter of Φ20 mm, and a 150 μm pure aluminum layer is formed on the surface of the copper pipe fitting;

[0032] Then, if figure 2 As shown, the full immersion method is used to vertically fix the hot-dip aluminized copper pipe fitting 2 and then immerse it in the treatment solution in the treatment tank as a whole, place the electrode rod 1 in the center of the inner cavity of the pipe fitting 2, and then place the electrode rod 1 Connect the negative pole of the pulsed DC power supply 3, connect the tube 2 to the positive pole of the pulsed DC power supply 3, apply a voltage to the tube 2 through the pulsed DC power supply 3, gradually adjust the voltage value, and maintain a constant current density of 0.02A / cm 2 , the processing time is 30 to 50 minutes. Under the action of the electrode rod 1, a ceramic layer is grown on the inner and ...

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Abstract

The surface ceramizing treatment process for pipe of non-valve metal or non-metal includes the following steps: 1. forming valve metal layer of 50-150 micron thickness in the inner and outer surface of the pipe through composite filming process; and 2. fixing electrode rod connected to negative pole of DC power source in the inner cavity of the pipe, connecting the pipe to the positive pole of the power source, soaking the pipe into alkali treating liquid inside treating tank, and maintaining constant current density to treat for proper period. The treatment process of the present invention is suitable for the surface ceramizing of pipe unsuitable for being ceramized in micro plasma process and has the problem of ceramizing the inner surface of pipe solved.

Description

technical field [0001] The invention belongs to the technical field of surface ceramic treatment of pipe fittings. Background technique [0002] Micro plasma oxidation technology is a new surface treatment technology developed on the basis of anodic oxidation in the past ten years. It is also called electrolytic plasma processing (Electrolytic Plasma Processing) or anode spark deposition (Anodic Spark Deposition). , Ti, Al, Mg, Nb, Zr, Ta and other valve metals and their alloys are placed in the treatment solution under high current, and the surface of the sample generates a micro-arc discharge under the action of a pulsed electric field, and finally forms a ceramic layer that is metallurgically bonded to the substrate , this layer of ceramic layer has excellent high temperature resistance, wear resistance, corrosion resistance and insulation properties. Chinese invention patents CN 1369577A, CN 1388272A and CN1432669A respectively disclose methods for ceramicizing metal ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/02
Inventor 杨思泽顾伟超
Owner INST OF PHYSICS - CHINESE ACAD OF SCI
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