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Flexible circuit substrate

A flexible circuit substrate, anisotropic technology, applied in the direction of circuit, printed circuit components, printed circuit structural connection, etc., can solve the problems of warpage, undulation, operation obstacles and other problems of flexible circuit substrate, and achieve the effect of good workability

Inactive Publication Date: 2006-01-18
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Here, when the flexible circuit substrate is heated and pressed onto the display panel 20, the flexible circuit substrate itself tends to be warped and undulated, which constitutes an obstacle to the work.

Method used

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Examples

Experimental program
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Embodiment 1

[0026] figure 1 It is a plan view of Embodiment 1 of the present invention, showing an end portion of a flexible circuit board provided with a connection terminal connected to a target device such as a display panel. exist figure 1 In the center of , 12 surface treatment layers (terminals) 6 are arranged at equal intervals along the longitudinal direction in the figure, and marks 6a extend from the left and right outermost terminals 6 .

[0027] Then, on the circuit board 10A, the anisotropic conductive resin layer 7 is formed on a region extending from the outer edge 11 of the board including the terminals 6 and the marks 6a to a little inside. For this reason, the filling amount of the anisotropic conductive resin must be appropriate and cannot be used too much.

[0028] In addition, in figure 1 In the diagram, the back rough wiring layer 3 on the back side of the circuit board 10A is indicated by dotted lines (contours) and hatched lines (copper foil). The outer edge...

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PUM

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Abstract

To provide a flexible circuit board that has hardness not to cause deflection or waving and has excellent workability in connecting to an object equipment or object board. A terminal for connecting to an object equipment or object board through an anisotropic conductive resin layer as well as a wiring layer having a terminal region at its end where a mark representing the position of the terminalis provided are formed on at least one surface of an insulating layer of the flexible circuit board. The flexible circuit board 10A comprises a solid wiring layer 6b provided with an opening for seeing through the mark at the position out of the inside terminal region, with the outer edge of the anisotropic conductive resin layer inside the outer edge of the circuit board and the terminal region as an edge, corresponding to the terminal region of the surface opposite to the surface where the wiring layer corresponding to the terminal region is provided. The insulating layer 1 has transparencyto see through the solid wiring layer.

Description

technical field [0001] The present invention relates to flexible circuit substrates, and more particularly, to flexible circuit substrates connected to target machines or target substrates using anisotropic conductive resins. Background technique [0002] For example, the connection between the terminals of the display panel and the circuit is carried out by connecting the flexible circuit substrate with an anisotropic conductive resin layer, that is, an anisotropic conductive resin is arranged between the terminals of the display panel and the terminals of the flexible circuit substrate, and then heated Connection is performed under pressure (refer to Japanese Patent No. 3423277). [0003] Figure 6 The structure of this conventional flexible circuit board is shown with a sectional view. Wiring layers 2, 3, such as copper foil, are arranged on the front and back surfaces of the resin sheet 1 constituting the base, and through-hole plating 4 is applied to connect the two wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H01L21/60H05K3/32H05K1/14
Inventor 坂井信幸
Owner NIPPON MEKTRON LTD
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