Print circuit board with improved heat rejection structure and electronic device

Abstract

This invention discloses a printed circuit board to improve dissipating heat structure, suitable for a packing base plate of multiply packing blocks, which comprises a first top layer located on a base plate and relative to a pack base plate, a second top metal layer located on the base plate and on the side of pack base plate; a inner metal layer located in the base plate; a first and second heat conducting bullet located in the base to make the inner metal layer individually linked to the first top layer and the second one. The invention also discloses a electron device to better dissipating structure.

Description

Technical field: [0001] The present invention relates to an electronic device, in particular to an electronic device with an improved heat dissipation structure and a multi-package module (MPM). Background technique: [0002] Portable electronic products, such as cell phones, mobile computing and other consumer products need to exhibit high performance and functionality under the constraints of thin thickness, light weight and low cost. Therefore, manufacturers are driven to increase the density of semiconductor chips. That is, manufacturers have begun to turn to three-dimensional (3D) packaging, and multiple chips are stacked in one package by assembly techniques such as wire bonding or flip chip. [0003] Therefore, multi-package module (multi-package module, MPM) has recently attracted more and more attention, which can integrate chips with different functions on a package substrate, such as microprocessors or memory, logic and optical integrated circuits, etc., replacin...

AI Technical Summary

Problems solved by technology

[0005] However, for high-power chips that generate high heat, the above-mentioned passive cooling cannot provide optimal heat dissipation effect and high heat dissipation rate.

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