Solder coherence method
A solder and attachment point technology, used in welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as wire breakage, difficult solder, and solder attachment point disconnection.
Inactive Publication Date: 2006-04-05
PIONEER CORP +1
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Problems solved by technology
[0006] However, in the solder attachment method (dipping method) of vertically inserting into the lead-free solder tank J6 and immersing in the lead-free solder J7, copper (Cu) dissolves into the attached solder, that is, a so-called "copper corrosion" phenomenon occurs, There are problems such as thin wires near the end of the wire diameter of the solder attachment point, and wire breakage occurs soon
[0009] So, in figure 1 In the solder attachment method of the dipping method shown above, although the heating temperature of the lead-free solder tank J6 can be set at 350°C to 420°C, and the solder can be attached by adjusting the dipping time, if the dipping time is too short, The attached solder hangs down due to gravity, so that the solder cannot be fully attached. In addition, if the immersion time is longer than the appropriate time, although the solder can be attached sufficiently, the above-mentioned "copper corrosion" phenomenon also proceeds, and copper of 5% or more of the wire diameter occurs. corrosion, these solder attachment points have a high probability of disconnection, making proper solder attachment difficult
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[0019] The present invention relates to a method for attaching solder to wires such as insulating coated wires, and in particular to a method for pre-soldering a voice coil wire of a speaker device.
[0020] Hereinafter, the embodiment of the present invention will be described with reference to the accompanying drawings, image 3 (a)~ image 3 (c) explains the method of attaching the solder to the lead wire 1 (the lead wire having the insulating coating 3 protecting the copper core 2).
[0021] Such as image 3 As shown in (a), a lead wire 1 is prepared, which includes a copper core 2 at its center and has an insulating coating 3 for protecting the periphery of the copper core 2 . Then, if image 3 As shown in (b), remove the insulating coating 3 at one end of the wire 1 to expose the end 2A of the copper core 2 (the remaining insulating coating 3 is called the insulating coating 3A), and then, as image 3 As shown in (c), the flux S is attached to the surface of the end ...
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To suppress any ''copper corrosion cracking'' phenomenon by the solder adhering method of unleaded solder. This solder adhering method of a lead wire 1 is provided with a lead wire 1; an unleaded solder tank 11 having unleaded solder 10 in which the lead wire 1 is immersed; and a means for heating the unleaded solder tank 11 for immersing the lead wire 1 in the heated unleaded solder tank 11, and for adhering the lead wire 1 to the unleaded solder 10. After a copper core 2 of the solder adhered part of the lead wire 1 is exposed, the copper core 2 is horizontally immersed in the unleaded solder 10 of the unleaded solder tank 11, and made to horizontally slide so that the copper core 2 of the lead wire 1 can be adhered to the unleaded solder.
Description
technical field [0001] The present invention relates to a solder attachment method for wires. Background technique [0002] So far, as a soldering method for wires, a soldering method that mainly uses lead solder (for example, Sn-55PB (also called H45A)) is generally used. The method is changed from a solder attachment method based on leaded solder to a solder attachment method based on lead-free solder (hereinafter referred to as lead-free). This is because lead solder mainly uses lead (Pb), which has adverse effects on the human body. After these products using lead solder are discarded and landfilled, the lead (Pb) will dissolve in the ground, which may cause harm to the human body or adverse effects on the environment. [0003] Therefore, the use of this harmful leaded solder must be discontinued and various lead-free based solder attachment methods must be implemented. Lead-free solders include, for example, Sn-0.7Cu, Sn-3Ag-0.5Cu, and the like, most of which are mad...
Claims
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Inventor 川田真季本田正二
Owner PIONEER CORP