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Circuit device and manufacturing method thereof

A technology of circuit device and manufacturing method, which is applied in the direction of printed circuit manufacturing, circuit, printed circuit, etc., to achieve the effects of improving heat dissipation performance, preventing peeling, and reducing hardening shrinkage

Inactive Publication Date: 2006-04-05
SANYO ELECTRIC CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the entire device is greatly deflected, there is also a problem that the device cannot be brought into contact with heat sinks such as heat sinks.

Method used

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  • Circuit device and manufacturing method thereof
  • Circuit device and manufacturing method thereof
  • Circuit device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Structure of Hybrid Integrated Circuit Device 10

[0035] refer to figure 1 The configuration of the hybrid integrated circuit device 10 of the present invention will be described. First, an insulating layer 18 is formed on the surface of the rectangular circuit substrate 11 . The conductive pattern 13 of a predetermined shape is formed on the surface of the insulating layer 18 . In addition, the semiconductor element 15A and the chip element 15B are electrically connected to predetermined portions of the conductive pattern 13 . Conductive pattern 13 , semiconductor element 15A, and chip element 15B formed on the surface of circuit substrate 11 are covered with sealing resin 14 .

[0036]The circuit substrate 11 is a substrate made of metal such as aluminum or copper. When the material of the circuit substrate 11 is aluminum, the coefficient of thermal expansion of the circuit substrate 11 is 23×10 -6 / °C or so. The specific dimensions of the circuit substrate 11...

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PUM

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Abstract

Warping of a hybrid integrated circuit device 10 due to shrinkage on curing of a sealing resin 14 is suppressed. The hybrid integrated circuit device 10 includes: a conductive pattern 13 provided on a surface of a circuit board 11 ; circuit elements 15 fixed to the conductive pattern 13 ; thin metal wires 17 electrically connecting the circuit elements 15 to the conductive pattern; leads 16 which are connected to the conductive pattern 13 to become output or input and extended to the outside; and a sealing resin 14 which is made of a thermosetting resin and covers the circuit board 11 by transfer molding while at least a rear surface of the circuit board is exposed. Here, a thermal expansion coefficient of the sealing resin 14 is set to be smaller than a thermal expansion coefficient of the circuit board 11 . Thus, warping of the circuit board 11 in an after cure step can be prevented.

Description

technical field [0001] The present invention relates to a circuit device and a method of manufacturing the same, and more particularly to a circuit device and a method of manufacturing the same in which warpage of a substrate due to thermosetting of a sealing resin is reduced. Background technique [0002] refer to Figure 7 The configuration of a conventional hybrid integrated circuit device 100A will be described. [0003] refer to Figure 7 (A) illustrates the structure of a conventional hybrid integrated circuit device 100 . A conductive pattern 103 is formed on the surface of the rectangular substrate 101 via an insulating layer 102 . A predetermined circuit is formed by fixing circuit elements at desired positions of the conductive pattern 103 . Here, the semiconductor element 105A and the chip element 105B are connected to the conductive pattern 103 as circuit elements. The back surface of the semiconductor element 105A is fixed to the conductive pattern 103 via a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/28H01L23/31H01L21/56H05K1/18H05K3/00
CPCH01L2924/19105H01L2924/01082H01L23/3121H05K3/284H01L2224/97H01L2924/3511H01L2924/01002H05K2201/0209H01L2924/01322H01L2924/01029H05K1/0271H01L2924/19041H01L2224/48091H01L2924/01013H01L2924/30107H01L23/3135H01L23/293H01L24/97H01L2924/0103H01L2924/01047H01L2924/3011H01L24/48H01L21/565H01L2924/14H05K1/056H05K2203/0315H01L2924/01005H01L2924/01033H01L2924/01006H05K2201/068H01L23/49531H05K3/285H01L2224/73265H01L2224/451H01L2924/15747H01L2924/181H01L2924/00014H01L24/45H01L2224/85H01L2924/00H01L2224/05599H01L2924/00012A47J27/02A47J36/02A47J27/002Y10S220/912
Inventor 新井一正久保田裕五十岚优助西塔秀史茂木昌巳坂本则明
Owner SANYO ELECTRIC CO LTD