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LED light fixture

A technology for LED lamps and LED devices, applied in the cooling/heating device, lighting device, light source and other directions of lighting devices, can solve the problems of shrinkage, long processing cycle, high cost of thermally conductive silica gel, increase product cost, etc., and achieve good heat dissipation effect. , the effect of reducing processing equipment and sites, and reducing overall costs

Inactive Publication Date: 2006-04-19
李旭明 +2
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Problems solved by technology

The middle path of the secondary heat dissipation is completed by heat-conducting silica gel material. Due to the high cost of heat-conducting silica gel, it is bound to increase the product cost
However, for most LED lamps, because cement and other materials have a specific gravity of about 4 or more, the resulting bulkiness, shrinkage, and long processing cycle make this technology still difficult to become a perfect solution for LED secondary heat dissipation.

Method used

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Embodiment Construction

[0013] The invention provides an LED lamp capable of good secondary heat dissipation. This lamp adopts several LED devices as light sources, forms a closed cavity between the LED device and the radiator, and injects liquid heat-conducting insulating material into the cavity. Conduct heat transfer from the LED device to the heat sink. Since the LED device is usually considered to conduct heat from the pins of the bracket when it is packaged, the pins of the LED device can be extended into the cavity and connected according to a set circuit structure (such as a series or parallel structure). In this way, the heat of the LED device can be fully transferred to the heat-conducting insulating liquid.

[0014] As a simple example of the invention, combining figure 1 (a) ~ (c), is a LED spotlight module, using a number of closely arranged straw hat-shaped LEDs as illuminants, including a number of straw hat-shaped LED lamps with two pins 1. Metal heat sink used as heat sink Sheet 2,...

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Abstract

A LED lamp is prepared as connecting LED component to heat radiating body through sealed cavity and containing heat ¿C conductive insulation liquid in sealed cavity. It features that heat ¿C conductive insulation liquid is applied as heat ¿C conductive material of LED secondary heat radiation so heat can be transferred from LED component frame to heat radiating body effectively and quickly by means of convection and transmission.

Description

【Technical field】 [0001] The invention relates to lighting technology, in particular to an LED lamp. 【Background technique】 [0002] LED, that is, light-emitting diode, has been widely used in various occasions such as landscape lighting and large-screen display due to the rapid development of main technical indicators such as brightness in recent years, and will enter the field of general lighting on a large scale. In the process of energizing and emitting light, LED will generate a lot of heat. These heats are very harmful to LED devices, and the generated heat must be dissipated by appropriate means to ensure that the LEDs work within an appropriate temperature range. [0003] The heat dissipation process of LED can be divided into primary heat dissipation and secondary heat dissipation. Primary heat dissipation refers to chip-level heat dissipation, which is achieved through the packaging technology of LED devices, such as substrates, brackets, or improved structures, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21Y101/02F21V29/56F21V29/85F21Y105/16F21Y115/10
Inventor 吕大明连伟李旭明
Owner 李旭明