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System and method in use for determining half-and-half folded compensating parameter

A technology for compensating parameters and compensating data, which is applied in the field of overlapping compensation parameter setting, can solve the problems of unusable, unadjustable, cost- and time-consuming, etc., so as to avoid cost increase, increase stacking accuracy, and avoid product performance degradation. and the effect of

Inactive Publication Date: 2006-04-19
PROMOS TECH INC
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, the above-mentioned traditional method cannot adjust the offset of this machine
Moreover, a certain machine usually processes a variety of different products. When a product is to be processed, it may have been processed for a very long time before, and it is impossible to use the overlay data of the previous processed batch of the product to determine Overlap compensation parameters for newly processed batches
[0010] When the overlay data of the previous processed batch of the product cannot be used to determine the overlay compensation parameters of the new processed batch, the overlay compensation parameters are traditionally measured with a blank test machine, and this method is very time-consuming and materials, causing great damage to product performance and cost control
[0011] In short, in the case of producing a variety of products, when the overlay data of the previous batch cannot be used to determine the overlay compensation data of the new batch, that is, the overlay must be determined by the cost- and time-consuming blank test machine Compensation parameters

Method used

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  • System and method in use for determining half-and-half folded compensating parameter
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  • System and method in use for determining half-and-half folded compensating parameter

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Embodiment Construction

[0026] In order to make the purpose, features, and advantages of the present invention more obvious and understandable, the preferred embodiments are specifically cited below, together with the attached drawings Figure 1 to Figure 6 , for details. According to an embodiment of the present invention, the system for determining overlay compensation parameters provided by the present invention is applied to an exposure machine that continuously processes multi-product wafer batches, but it is not intended to limit the present invention. The overlay compensation determination of the present invention The parametric systems and methods are not limited to wafer fabrication.

[0027] A system and method for determining overlay compensation parameters according to the present invention will be described below by taking the manufacture of a wafer factory as an example.

[0028] figure 1 A schematic diagram showing an exposure fabrication device with parameters for determining overla...

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Abstract

Being suitable to exposure machine platform for treating batches of multiple products continuously, the system includes executive logging base of machine platform, half-and-half folded database, and half-and-half folded control device. The executive logging base of machine platform is in use for storing records for treating batches of products by machine platform. Corresponding to a layer of one product, each batch of one product treated contains recorders in current batch and previous batch. The half-and-half folded database stores historic records of half-and-half folded compensating data of corresponding products in current batch and previous batch. Based on historic records, the half-and-half folded control device determines setting values of half-and-half folded compensating parameters at current batch.

Description

technical field [0001] The present invention relates to the control of the exposure machine, in particular to a method of using the overlay data of the product batches previously processed by the semiconductor lithography exposure machine to determine the setting of the overlay compensation parameters for the currently processed product batches. Methods and systems for increasing overlay accuracy. Background technique [0002] In the semiconductor industry, the manufacture of very large-scale integrated circuits (VLSI) is mainly on silicon substrates (that is, wafers), using semiconductor manufacturing technology to repeatedly define and form millions of semiconductor elements, and connect them with several layers of conductors. Wires connect components to external wires. [0003] In the manufacture of such a highly integrated integrated circuit, it is necessary to use the exposure machine (Projection Aligner) in the lithography equipment, such as scanning or stepping align...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F7/00H01L21/00
Inventor 李永尧
Owner PROMOS TECH INC