System and method for forming patterns on basis material

Abstract

Provided are a high resolution lithography system and method. In one example, a method for producing a pattern on a substrate includes separating the pattern into at least a first sub-pattern containing lines oriented in a first direction and a second sub-pattern containing lines oriented in a second direction. Lines oriented in the first direction are created on a first layer of photosensitive material on the substrate using a first standing wave interference pattern. A portion of the created lines are trimmed to create the first sub-pattern. A second layer of photosensitive material is applied to the substrate after creating the first sub-pattern. Lines oriented in the second direction are created on the second layer using a second standing wave interference pattern. A portion of the created lines are trimmed to create the second sub-pattern.

Description

technical field [0001] The present invention relates to the field of semiconductor manufacturing, and more particularly to an interference lithography system and method for fabricating patterns in photosensitive materials. Background technique [0002] This application is a continuation-in-part of US Patent Application Serial No. 10 / 309,427, filed December 4, 2002, which is hereby incorporated by reference. [0003] In general, the fabrication of microelectronic integrated circuits involves patterning device structures and layouts on semiconductor substrates. The accepted way of making the desired pattern is to create a replica of the pattern on a reticle (not necessarily to its final dimensions), then transfer the reticle pattern to a layer of photosensitive material, either positive or negative, on a semiconductor substrate. resistance. The transfer of the pattern can be achieved by the optical lithography process to project a certain wavelength of light onto the photore...

AI Technical Summary

Problems solved by technology

[0006] It can be seen that the above-mentioned existing system for making patterns on the substrate obviously still has inconvenience and defects in structure, method and use, and needs to be further improved urgently.

In order to solve the problems existing in the system of manufacturing patterns on the substrate, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve it. The above-mentioned problems are obviously the problems that relevant industry players are eager to solve

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