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Electrostatic chuck for substrate stage, electrode used for same, and processing system having the chuck and electrode

An electrostatic chuck and processing system technology, applied in the field of processing systems, can solve problems such as low reliability, increased electrode manufacturing cost, and extended product delivery time, and achieve the effects of low price, easy processing, and high reliability

Inactive Publication Date: 2006-08-09
FUTURE VISION
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the electrostatic chuck for the substrate stage used in the conventional plasma processing apparatus such as this and its electrode, since a ring-shaped, semi-circular or concentric circular integrated plane with multi-layer sprayed coating is used, Electrodes, so in the case of a part of the electrode is damaged, it is necessary to replace all the electrodes to repair
In addition, since the thermal spray coating on the electrode is multi-layered, the reliability will be extremely low when the substrate as the object to be processed is enlarged and used under high temperature conditions.
Furthermore, since the electrode has an integral structure (single electrode) or is only divided into 2 or 3 parts, special equipment is required due to the enlargement of the production equipment, and the manufacturing cost of the electrode increases, and the lead time of the product tends to be prolonged.

Method used

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  • Electrostatic chuck for substrate stage, electrode used for same, and processing system having the chuck and electrode
  • Electrostatic chuck for substrate stage, electrode used for same, and processing system having the chuck and electrode
  • Electrostatic chuck for substrate stage, electrode used for same, and processing system having the chuck and electrode

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Embodiment Construction

[0018] Embodiments of an electrostatic chuck for a substrate mounting table, electrodes used therefor, and a processing system including them according to the present invention will be described in detail below with reference to the drawings.

[0019] Plasma treatment device

[0020] The plasma processing apparatus 1 using the electrostatic chuck for a substrate mounting table of the present invention is configured to perform continuous transfer processing of a substrate G (for example, a glass substrate), that is, in-line processing. The substrate stage 9 on which the substrate G is placed faces the conveying direction (arrow →) in the substrate transfer / preheating / adsorption zone A with the heating unit 20, the heating zone B, the film formation or The etching zone C and the cooling / release transfer zone D with the cooling unit 31 are sequentially transported to the positions 9b→9c→9d→9e→9f by the circular substrate conveying mechanism 8 with a return loop, while performing ...

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Abstract

An electrostatic chuck for a substrate stage, wherein highly pure ceramics is thermally sprayed on the surfaces of bar-like base materials to form a single layer thermally sprayed film so as to form electrodes. The plurality of electrodes are arranged at specified intervals.

Description

technical field [0001] The present invention relates to an electrostatic chuck for a substrate mounting table used for plasma processing of various substrates such as large glass substrates and semiconductor wafers for flat panel displays (FDP), electrodes used therein, and a processing system including them. Background technique [0002] As a substrate stage (substrate stage) of a plasma processing apparatus used for various substrates such as glass substrates and semiconductor wafers (semiconductor wafers) for FDP (hereinafter, collectively referred to as substrates), conventionally, for example, An electrostatic chuck that attracts a wafer by electric Coulomb force is used. In addition, as the structure of the electrostatic chuck, there are mono-pole type (mono-pole type) and bi-pole type (bi-pole type), in which the mono-pole type is to apply a potential difference between the internal electrode and the substrate to attract the electrostatic chuck. Substrate, bipolar ty...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68H01L21/3065H02N13/00H01L21/683
CPCH01L21/6831H02N13/00H01L21/687
Inventor 小林聪树岩渕胜彦
Owner FUTURE VISION
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