Etching liquid, bulking liquid and forming method of conductive image using same

Abstract

To provide an etching liquid and refilling liquid which can promptly etch at least one metal chosen from Ni, Cr, Ni-Cr alloy, and Pd, and a forming method of conductor pattern using it. The etching liquid or a solution of water, which contains at least one component chosen from NO, N2O, NO2, N2O3 and these ions, and an acid component, etches at least one metal chosen from Ni, Cr, Ni-Cr ally and Pd. The forming method of a conductor pattern (1) forms the conductor pattern (1) by etching at least one metal chosen from Ni, Cr, Ni-Cr alloy and Pd with the liquid.

Description

technical field [0001] The present invention relates to an etchant and replenishment liquid for etching at least one metal selected from Ni, Cr, a Ni-Cr alloy, and Pd, and a method for forming a conductor pattern using the etchant and replenishment liquid. Background technique [0002] Conventionally, printed circuit boards have been widely used as wiring components for electrical products and electronic devices. A printed circuit board is a substrate on which a wiring pattern is formed on the surface of an electrically insulating base material. Among them, flexible substrates using flexible films such as polyimide films as electrically insulating substrates are not only superior to rigid substrates in terms of lightness and thinness, but also can be used in movable parts such as motor peripheral parts because they can be bent. Demand is growing. In addition, the demand for flexible substrates used as packaging base materials for liquid crystal modules has also been growin...

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Problems solved by technology

[0004] However, in the conventional etchant containing ferric chloride as the main component, since the etching rate of the metal constituting the bottom layer is relatively slow, there is a possibility that the copper layer may be dissolved by the above-mentioned etching during the etching of the bottom layer.

If the copper layer dissolves, the height and width of the wiring will decrease, and the resistance of the wiring will increase, or disconnection may occur

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