Etching liquid, bulking liquid and forming method of conductive image using same

A conductor pattern and etching solution technology, applied in the field of conductor pattern formation, can solve the problems of slow etching speed, copper layer dissolution, wiring resistance increase, etc.

Active Publication Date: 2006-08-16
MEC CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the conventional etchant containing ferric chloride as the main component, since the etching rate of the metal constituting the bottom layer is relatively slow, there is a possibility that the copper layer may be dissolved by the above-mentioned etching during the etching of the bottom layer.
If the copper layer dissolves, the height and width of the wiring will decrease, and the resistance of the wiring will increase, or disconnection may occur

Method used

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  • Etching liquid, bulking liquid and forming method of conductive image using same
  • Etching liquid, bulking liquid and forming method of conductive image using same

Examples

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Embodiment

[0047] Next, examples of the etching solution of the present invention will be described in conjunction with comparative examples. However, the present invention is not limited to the following examples.

[0048] (Preparation of etching solution)

[0049] The components shown in Table 1 were mixed to prepare etching solutions of Examples 1-8. In addition, the components shown in Table 2 were mixed to prepare etching solutions of Comparative Examples 1-3. In addition, the etching solutions of Examples 5 and 8 were prepared by mixing components other than nitrogen oxide (NO), and blowing 3 liters of NO gas with respect to 1 kg of the mixed solution.

[0050] (Etching of Ni-Cr alloy)

[0051] A material to be processed in which a Ni-Cr alloy film was formed on a polyimide film by sputtering was prepared. In the material to be processed, the thicknesses of the polyimide film and the Ni-Cr alloy film were 50 μm and 0.1 μm, respectively, and the atomic ratio (Ni / Cr) of Ni and Cr...

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Abstract

To provide an etching liquid and refilling liquid which can promptly etch at least one metal chosen from Ni, Cr, Ni-Cr alloy, and Pd, and a forming method of conductor pattern using it. The etching liquid or a solution of water, which contains at least one component chosen from NO, N2O, NO2, N2O3 and these ions, and an acid component, etches at least one metal chosen from Ni, Cr, Ni-Cr ally and Pd. The forming method of a conductor pattern (1) forms the conductor pattern (1) by etching at least one metal chosen from Ni, Cr, Ni-Cr alloy and Pd with the liquid.

Description

technical field [0001] The present invention relates to an etchant and replenishment liquid for etching at least one metal selected from Ni, Cr, a Ni-Cr alloy, and Pd, and a method for forming a conductor pattern using the etchant and replenishment liquid. Background technique [0002] Conventionally, printed circuit boards have been widely used as wiring components for electrical products and electronic devices. A printed circuit board is a substrate on which a wiring pattern is formed on the surface of an electrically insulating base material. Among them, flexible substrates using flexible films such as polyimide films as electrically insulating substrates are not only superior to rigid substrates in terms of lightness and thinness, but also can be used in movable parts such as motor peripheral parts because they can be bent. Demand is growing. In addition, the demand for flexible substrates used as packaging base materials for liquid crystal modules has also been growin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/06C23F1/16
CPCA61G17/007A61G17/08
Inventor 栗山雅代秋山大作
Owner MEC CO LTD
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