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Suspension arm probe

A cantilever and probe technology, applied in the field of cantilever probes, can solve problems such as stress concentration, fatigue damage of rod 92 structure, etc.

Inactive Publication Date: 2006-08-23
MPI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the structure of the above-mentioned cantilever probe 90 is subjected to an external force, stress concentration is likely to occur at the position where the rod 92 and the fixed part 91 are connected to each other. When the test object 95 is tested for a long time, the rod will often 92 structures fatigue failure from this position

Method used

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  • Suspension arm probe
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Embodiment Construction

[0023] Hereinafter, some preferred embodiments are listed in conjunction with the accompanying drawings to describe the structure and effect of the present invention in detail.

[0024] see figure 1 As shown, it is the cantilever probe 10 provided by the first preferred embodiment of the present invention. The probe 10 includes a fixed part 11 and a rod 13. The fixed part 11 is formed by a folded board, so that The fixing part 11 is an elastic body. One end of the rod 13 has a pointed part 15, and the other end is arranged on the top of the fixing part 11. The rod 13 and the fixing part 11 are perpendicular to each other. The bottom of the fixing part 11 is arranged on a body 19 , so that the rod 13 extends horizontally from the fixing part 11; the probe 10 can be set on the circuit board 18 of a probe card for testing the integrated circuit.

[0025] The manufacturing method of the cantilever probe 10 of the first preferred embodiment of the present invention, such as fig...

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PUM

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Abstract

A cantilever type probe contains a fixed portion and bar connected to fixed portion, wherein the bar and fixed portion having different elastic coefficient. Present invention can increase probe constructional elasticity and reduce probe fatigue damage.

Description

technical field [0001] The present invention relates to probes, in particular to a cantilever probe. Background technique [0002] In the semiconductor industry, when the integrated circuit chip is completed but before the packaging process, the circuit function of the chip must be tested through a testing program; the testing program is to use a probe card between the test machine and the chip, the probe card There are a number of cantilever type probes, each of which touches the bonding pads of the chip, so that the test signal of the tester can be transmitted back and forth between the chip and the tester. [0003] The cantilever type (Cantilever Type) probe 90 of the general probe card, such as Figure 14 As shown, it includes a fixing part 91 and a rod 92, the fixing part 91 is upright on a body 93, one end of the rod 92 is arranged on the top of the fixing part 91, and the other end has a tip 94; the rod 92 is a self-fixing part 91 extends in the air along the horizon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66G01R1/067
Inventor 洪文兴
Owner MPI CORP