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Method and apparatus for concurrently transmitting a digital control signal and an analog signal

A technology of analog signals and control signals, applied in the direction of transmission line coupling devices, transmission systems, digital transmission systems, etc., can solve the problems of increasing the overall cost of a single package system, cost increase, system complexity and packaging problems

Inactive Publication Date: 2006-08-23
AVAGO TECH ECBU IP (SINGAPORE) PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Understandably, as the number of bond wires increases, system complexity and packaging issues increase proportionally
In addition, as the number of bonding wires increases, the cost of packaging the integrated circuit or chip in a single-package system (SiP) increases, thereby increasing the overall cost of the single-package system (SiP)

Method used

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  • Method and apparatus for concurrently transmitting a digital control signal and an analog signal
  • Method and apparatus for concurrently transmitting a digital control signal and an analog signal
  • Method and apparatus for concurrently transmitting a digital control signal and an analog signal

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Embodiment Construction

[0022] Methods and apparatus for simultaneously transferring logical information (eg, binary data or digital signals) and analog signals (eg, differential data signals) from a transmitting circuit to a receiving circuit are described below. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the subject matter of the present invention.

[0023] System in Package (SiP)100

[0024] figure 1 A system-in-a-package (SiP) 100 is shown in which a signal transmission mechanism may be included in accordance with one embodiment of the invention. A system in package (SiP) 100 includes multiple integrated circuits ...

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PUM

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Abstract

The present invention describes methods and systems for simultaneously transmitting digital control signals and analog signals from a transmitting circuit to a receiving circuit. An analog signal (eg, a differential data signal) is received. Digital signals (eg, digital logic signals) are also received. The digital signal is then combined with the analog signal to generate an analog signal with the digital signal embedded. The analog signals with embedded digital signals are then transmitted over a common communication link (eg, a pair of conductors). The digital signal is then recovered from the analog signal with the embedded digital signal without affecting the recovered analog signal.

Description

technical field [0001] The present invention relates to methods and apparatus for simultaneously transmitting digital control signals and analog signals from a transmitting circuit to a receiving circuit. Background technique [0002] In today's competitive electronics market, manufacturers must meet consumer demands for lighter, smaller, more portable products with more functions and features. To support this demand, current research and development trends in semiconductor devices, microelectronics, and electronic devices are miniaturization, higher integration levels, faster operating speeds, and lower power consumption. [0003] It has been noted that advancements in packaging technology are required to provide devices and assemblies that meet these trends. A promising packaging technology is called chip scale package (CSP for short). For example, wafer-level chip size packaging (wafer-level chip size packaging, abbreviated as WLCSP) or wafer-level chip-scale packaging ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04L5/00
CPCH04L25/0264H04L5/00H04L25/0276G06F13/38
Inventor 林国强柯外岚
Owner AVAGO TECH ECBU IP (SINGAPORE) PTE LTD