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Passive element packaging structure and making method thereof

A technology of passive components and packaging methods, which is applied in the direction of assembling printed circuits with electrical components, electrical components, and printed circuits connected with non-printed electrical components, which can solve the problems of large occupied space and non-compliance.

Inactive Publication Date: 2006-09-27
DELTA ELECTRONICS INC
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Problems solved by technology

[0007] Although the packaging process of the transformer module 30 solves the problem that the transformer module 10 needs to be additionally drilled on the printed circuit board and the electrical alignment problem, however, because the electrical pins are expanded from the two sides of the transformer and arranged on the printed circuit board board, therefore, it occupies a large space, which does not meet the requirements of today's small-sized components, and when the electrical demand required by the user increases, the electrical pins 36 of the transformer module 30 also need to be increased. , and it is impossible to achieve a better structural design in a limited space

Method used

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  • Passive element packaging structure and making method thereof
  • Passive element packaging structure and making method thereof
  • Passive element packaging structure and making method thereof

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Embodiment Construction

[0022] In order to describe the structure and principle of the passive component packaging structure and manufacturing method of the present invention in detail, the following passive components will use a transformer as an example to illustrate the spirit of the present invention.

[0023] Please refer to Figure 3A and Figure 3B . Figure 3A and Figure 3B is a schematic diagram showing the transformer module of the present invention. Such as Figure 3A and Figure 3B As shown, the transformer module of the present invention includes a base plate 50 and a plurality of annular iron cores 60 , 66 , 70 and 76 .

[0024] The cores 60 , 66 , 70 and 76 are wound with more than two coil windings 62 to serve as primary and secondary coils of the transformer. The substrate 50 is a printed circuit board (Printed CircuitBoard; PCB), which has a corresponding first surface 52 and a second surface 82. First, a plurality of pieces of copper or copper alloy metal are disposed on the...

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Abstract

This invention relates to a passive organ encapsulation structure and its making method, which includes a base board, multiple passive organs, a ball grid array and a casing, wherein the passive organs is arranged on the first surface of the base board, multiple tin balls is welded on the second surface of the base board by the ball grid array technique, the casing has a opening which covers and seals the base board to make the second surface of the base board expose at the opening of the casing.

Description

technical field [0001] The present invention relates to a passive component packaging structure and its related manufacturing method, in particular to a passive component packaging structure formed by using Ball Grid Array (BGA) packaging technology and its related manufacturing method. Background technique [0002] As a result of the highly informatized development of modern science and technology, people's demand for information processing has also increased. In order to quickly process and transmit huge amounts of data, it is usually necessary to use various sophisticated electronic equipment. However, with the change of life styles and the demands of the society, electronic equipment and electronic components are developing toward the trend of thinner, smaller, multi-functional, high-performance and high-speed. [0003] Among the various components contained in many electronic products, they can be mainly divided into two categories: active components and passive compone...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/00H01C1/01H01C1/02H01G2/06H01G2/10H05K1/18H05K3/30
Inventor 李新华许汉正
Owner DELTA ELECTRONICS INC
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