Thin circuit substrate and its manufacturing method
A technology for integrated circuits and functional circuits, which is applied in the field of thin circuit boards and their manufacturing, and can solve the problems of loss cost and yield reduction.
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Embodiment approach 1
[0041] FIG. 1 is an enlarged cross-sectional view of a part of a flat thin circuit board 101 mounted inside an electronic device such as a mobile phone. As shown in the figure, circuit board 101 includes base 102 made of an easily bendable thin and flexible film. A plurality of thin wirings 103 are formed on one or both main surfaces of the film 102, and a thin member 104 thinner than the wirings 103 that does not overlap with the wirings 103 is mounted between the plurality of wirings 103 (that is, next to the wirings). .
[0042] As the film material of the substrate 102, polyethylene terephthalate (PET: polyethyleneterephthalate), polyimide (polyimide), and polyphenylene sulfide (PPS: polyphenylenesulfide) are suitably used. In order to impart sufficient flexibility to the resin film, the thickness of the film is preferably about 5 to 150 µm. The film does not necessarily have to be a resin, for example, a metal film made of aluminum foil may be used. Generally speaking,...
Embodiment approach 2
[0047] FIG. 2 is an enlarged cross-sectional view of a part of a thin circuit board related to Embodiment 2. FIG. As shown in the figure, a multilayer wiring board 101A according to this embodiment is formed by laminating the single-layer wiring board 101 of the first embodiment described above. In this embodiment, three single-layer wiring boards 101 are stacked, but the number of stacked single-layer wiring boards 101 is not limited. Each single-layer circuit board 101 and another single-layer circuit board 101 connected thereto may be fully or partially bonded with an adhesive made of an insulating material. When a plurality of single-layer circuit boards 101 are not bonded, it is preferable to use an appropriate bonding member (for example, a clip) to connect them without being separated.
[0048] A component 104 mounted on one single-layer type circuit board 101 and a component 104 mounted on another single-layer type circuit board 101 adjacent to this circuit board 101 ...
Embodiment approach 3
[0052] FIG. 3 is a diagram showing a state in which the multilayer circuit board 101B is accommodated in the housing 110 . As shown in the figure, on the circuit board housing surface (upper surface) 111 of the housing 110, a deformed portion such as a concave dent 112 or a bent portion is formed. In addition, one or more holes 114 are formed to penetrate between the upper surface 111 and the lower surface 113 in the portion of the casing 110 where the recess 112 is formed.
[0053] In such a structure, when the circuit board 101B is accommodated in the cavity 112 as shown in the figure, the flat circuit board 101B is arranged on the surface 111 of the housing 110 so that it covers the cavity 112 . Next, the bore 114 is fluidly connected to a suction device 115 , vacuuming the interior space of the well 112 . As a result, easily deformable thin circuit board 101B is attracted and deformed by the negative pressure inside dent 112 , and is given a three-dimensional shape follow...
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