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Liquid jetting device, liquid jetting method, and method of forming wiring pattern on circuit board

A technology of liquid ejection head and equipment, which is applied in printing and other directions, and can solve the problems of reduced clarity, ink droplets not reaching the predetermined position, and dirty surrounding environment

Inactive Publication Date: 2006-10-18
KONICA MINOLTA INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the ink drop cannot reach the predetermined position
This causes phenomena such as loss of clarity and smearing, where scattered ink makes the surroundings dirty

Method used

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  • Liquid jetting device, liquid jetting method, and method of forming wiring pattern on circuit board
  • Liquid jetting device, liquid jetting method, and method of forming wiring pattern on circuit board
  • Liquid jetting device, liquid jetting method, and method of forming wiring pattern on circuit board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0170] (Overall structure of liquid ejecting equipment)

[0171] Refer below Figure 11-14C A liquid ejection device 10 as one embodiment of the present invention is explained. Figure 11 is a block diagram schematically showing the configuration of the liquid ejection device 10 .

[0172] The liquid ejection apparatus 10 includes a carrier K, a liquid ejection mechanism 50 for ejecting charged solution droplets on the carrier K, a thermostat 41 for accommodating the liquid ejection mechanism 50 and the carrier K on which the ejected droplets land, air Regulator 70, which serves as a unit for regulating the spraying environment, for regulating the temperature and humidity of the environment inside the thermostat 41, an air filter for filtering dust in the air circulating between the thermostat 41 and the air conditioner 70 42, a differential pressure gauge 43 for detecting the pressure difference between the inside and outside of the thermostat 41, a flow control valve 44 fo...

no. 2 example

[0269] Refer below Figure 18 The liquid ejection mechanism 101 according to the second embodiment of the electrostatic attraction type liquid ejection apparatus is explained. Figure 18 It is a schematic diagram showing main parts of the liquid ejection mechanism 101 . The nozzle 51 is shown facing downward in the same manner as in actual use. Among them, the same elements as those of the above-mentioned liquid ejection mechanism 50 are denoted by the same reference numerals, and their repeated descriptions are omitted.

[0270] It is assumed that the liquid ejection mechanism 101 is not used within the thermostat 41 which can be set to a suitable dew point, unlike the liquid ejection mechanism 50 described above. Therefore, the liquid ejection mechanism 101 suppresses the influence from the uneven potential distribution on the surface of the carrier using a method different from that used in the liquid ejection mechanism 50 .

[0271] Such as Figure 18 As shown, the liq...

no. 3 example

[0293] Refer below Figure 20 A liquid ejection mechanism 201 according to a third embodiment of the electrostatic attraction type liquid ejection apparatus will be described.

[0294] (the difference)

[0295] Such as Figure 20 As shown, the liquid ejection mechanism 201 is used outside the thermostat 41 as in the liquid ejection mechanism 101 , and includes the liquid ejection head 56 , and an ejection voltage applying unit having a charging unit 204 . The liquid ejection head 56 has the same structure as that of the second embodiment, but the ejection voltage applying unit having the charging unit 204 is different from that of the second embodiment. While the ejection voltage applying unit having the charging unit 104 applies a stable voltage in the second embodiment, the ejecting voltage applying unit having the charging unit 204 applies a pulse voltage in the third embodiment.

[0296] The ejection voltage applying unit having the charging unit 204 includes a stabiliz...

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Abstract

A liquid ejection apparatus comprising: a liquid ejection head (56) having a nozzle (51) for ejecting a small droplet of a charged solution from a tip portion; an ejection electrode (58) provided on the liquid ejection head for It applies a voltage to generate an electric field to eject the droplets; a voltage applying unit (35) for applying a voltage to the ejection electrodes; a carrier K including an insulating material for receiving the ejected droplets; and an ejection atmosphere adjusting unit (70) for maintaining the atmosphere subjected to ejection by the liquid ejection head at a dew point of 9°C or more and less than the saturation temperature of water.

Description

technical field [0001] The present invention relates to a liquid ejecting apparatus for ejecting liquid on a carrier, a liquid ejecting method, and a method for forming a wiring pattern on a circuit board. Background technique [0002] There is known an electrostatic attraction type inkjet printer as described in Patent Publication 1. This type of inkjet printer includes a plurality of raised ink conduits, each of which ejects ink from a tip portion, opposing electrodes disposed against the respective tips of the ink ejection conduits and grounded, and a The ink is applied to the ejection electrode of the ejection voltage. In addition, two kinds of raised ink conduits were prepared, each having a different groove width for guiding ink, and by selectively using these conduits, the raised ink conduits were able to eject ink droplets of two sizes. [0003] Such a conventional inkjet printer applies a pulse voltage to an ejection electrode to eject ink droplets, and guides the...

Claims

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Application Information

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IPC IPC(8): B41J2/06
Inventor 岩下广信山本和典西尾茂村田和广
Owner KONICA MINOLTA INC
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