Low-speed chain circuit data transmission apparatus and method in telecommunication apparatus

Abstract

The invention relates to a data transmitter in low-speed chain circuit and relative method. Wherein, said device comprises a low-speed chain circuit interface frame, a service processing frame, and a DDF support; said method comprises: the service data of service processing frame via high-speed chain circuit is transmitted to the low-speed chain circuit interface frame; the low-speed chain circuit interface frame processes said bus data to be transmitted to the DDF support via low-speed chain circuit. With said invention, the interface design of service processing frame can be simplified to improve the reliability of telecommunication equipment.

Description

technical field [0001] The invention relates to the communication field, in particular to a data transmission device and method for low-speed links in telecommunication equipment. Background technique [0002] With the rapid development of IC (Integrated Circuit) technology, the integration level of chips is getting higher and higher, and the performance is getting stronger and stronger. Therefore, for equipment suppliers, on a single board with the same area, there was only Mbit-level switching capability in the past, but now it can easily achieve Gbit-level switching capability. [0003] At the same time, telecommunications equipment such as switches, wireless network sides, and access devices often use low-speed link interfaces (such as E1 / T1 / J1 interfaces, which are described in this article as E1), because these low-speed link interfaces have mature technologies and stable standards. It is widely used in the field of telecommunications, and the supporting PDH (Pseudo-S...

AI Technical Summary

Problems solved by technology

[0009] 1. High requirements for low-speed link interface connectors;

[0010] 2. The outlet of the single board cable is easy to cause the deformation of the single board;

[0011] 3. It is difficult to route cables in single boards, subracks, and cabinets, and has high requirements for cable diameter, flexibility, and curvature;

[0012] 4. There are many outgoing lines on the interface board, the reliability is reduced, and it is difficult to locate the problem;

[0013] 5. High requirements for on-site installation;

[0014] 6. High-density connectors and high cable costs;

[0015] 7. Not beautiful;

[0016] 8. It is difficult to plug and unplug the interface board

[0017] In this method, not only the above-mentioned problems exist in the outgoing line, but also the area of ​​the single board panel is limited, and more subracks cannot be plugged in. Therefore, this method cannot fundamentally solve the above-mentioned processing boards with increasingly powerful performance and low-speed links. Contradictions

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