Illumination system for a microlithography projection exposure installation

A lighting system and exposure system technology, applied in the field of lighting systems, can solve problems such as complex structures

Inactive Publication Date: 2006-12-13
CARL ZEISS SMT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Suitable changing devices can be structurally complex

Method used

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  • Illumination system for a microlithography projection exposure installation
  • Illumination system for a microlithography projection exposure installation
  • Illumination system for a microlithography projection exposure installation

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Embodiment Construction

[0044] figure 1 Shows an example of an illumination system 10 for a projection exposure system for microlithography, which may be used in the production of semiconductor components or other fine structure components, and in order to achieve a resolution down to the micron level, the projection exposure system utilizes Operate with light in the deep ultraviolet range. The light source used is F 2 An excimer laser, which operates at a wavelength of approximately 157 nm, has a beam aligned coaxially with respect to the optical axis 12 of the illumination system. Similarly, other ultraviolet light sources can be used, such as an ArF excimer laser with a working wavelength of 193 nm, a KrF excimer laser with a working wavelength of 248 nm, or a mercury vapor lamp with a working wavelength of 365 nm or 436 nm, or a low wavelength light source at 157 nm.

[0045] The light from the light source 11 is first incident in the beam expander 13, which broadens the laser beam and, from t...

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Abstract

An illumination system for a microlithography projection exposure installation is used to illuminate an illumination field with the light from a primary light source (11). The illumination system has a light distribution device (25) which receives light from the primary light source and, from this light, produces a two-dimensional intensity distribution which can be set variably in a pupil-shaping surface (31) of the illumination system. The light distribution device has at least one optical modulation device (20) having a two-dimensional array of individual elements (21) that can be controlled individually in order to change the angular distribution of the light incident on the optical modulation device. The device permits the variable setting of extremely different illuminating modes without replacing optical components.

Description

technical field [0001] The invention relates to an illumination system for a Microlithography projection exposure system for illuminating an illumination field with light from an original light source. Background technique [0002] The efficiency of projection exposure systems for the microlithographic production of semiconductor components and other fine-structured components is essentially determined by the imaging properties of the projection objectives. Furthermore, the image quality and wafer throughput achievable with this system is also substantially determined by the nature of the illumination system arranged upstream of the projection objective. This must be able to produce the light from the original light source (eg a laser source) with the greatest possible efficiency and in the process, the most uniform intensity distribution in the illumination field of the illumination system. Furthermore, it should be possible to set various illumination modes (settings) of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/702G03F7/70116
Inventor J·克勒J·旺勒M·布洛特萨克W·辛格D·费奥卡M·毛尔
Owner CARL ZEISS SMT GMBH
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