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Focus determination method, device manufacturing method, and mask

A device and mask technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, instruments, etc., can solve the problem that the focus setting device structure is not optimal

Active Publication Date: 2011-03-02
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the determined optimum focus setting for the alignment mark is not optimal for the device structure

Method used

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  • Focus determination method, device manufacturing method, and mask
  • Focus determination method, device manufacturing method, and mask
  • Focus determination method, device manufacturing method, and mask

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0021] figure 1 A lithographic apparatus for one embodiment of the invention is schematically shown, comprising:

[0022] An illumination system (illuminator) IL arranged to adjust a radiation beam B (eg UV radiation or DUV radiation).

[0023] A support structure (eg mask table) MT arranged to support the patterning mechanism (eg mask) and connected to a first positioner PM arranged to precisely position the patterning mechanism according to certain parameters.

[0024] a substrate stage (e.g., a wafer table) WT configured to hold a substrate (e.g., a resist-coated wafer) W and connected to a second positioner PW configured to precisely position the substrate according to certain parameters; and

[0025] A projection system, such as a refractive projection focusing system, PS, is arranged to project the pattern applied by the radiation beam B of the patterning mechanism MA onto a target portion C of the substrate W (eg comprising one or more chips of the substrate W).

[0...

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PUM

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Abstract

One or more focus settings for use in a device manufacturing method is determined by printing a plurality of target markers at different focus settings and using a scatterometer, e.g. off-line, to measure a property of the target markers that is indicative of focus.

Description

technical field [0001] The present invention relates to a focus determination method, a device manufacturing method and a mask. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually to a targeted portion of the substrate. Photolithographic apparatus can be used to fabricate integrated circuits (ICs). In this case, the patterning mechanism, which can also be called a mask or a scribe, is used to form a circuit pattern and is formed on each layer of the IC. These patterns can be transferred to a target portion (including a portion, one or more chips) of a substrate (eg, a silicon wafer). The transferred pattern is typically by imaging a layer of radiation-sensitive material (resist) disposed on the substrate. Typically, a substrate can accommodate a grid of adjacent target portions, which are successively patterned. Known lithographic apparatuses include so-called steppers, in which each target portion is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/00G03F1/00
CPCG03F7/70641G03F7/70683G03F7/7085G03F9/7026H01L22/12
Inventor M·范德沙尔A·J·登博夫M·杜萨A·G·M·基尔斯
Owner ASML NETHERLANDS BV