Reinforced film for flexible printing circuit board

A flexible printing and reinforcing film technology, applied in the direction of printed circuits, printed circuit components, and electrical components to assemble printed circuits, which can solve problems such as rising prices, warping, and difficulty in manufacturing, and achieve the effect of inhibiting interface peeling

Inactive Publication Date: 2007-01-17
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when a heat-resistant resin film is used, there are problems such as difficulty in manufacturing, increase in price, and warpage as the thickness increases.

Method used

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  • Reinforced film for flexible printing circuit board
  • Reinforced film for flexible printing circuit board
  • Reinforced film for flexible printing circuit board

Examples

Experimental program
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Effect test

Embodiment 1

[0020] figure 1 A cross-sectional structure of a heat-resistant film having a three-layer structure as Example 1 of the present invention is shown. The water vapor transmission coefficient of the heat-resistant resin film of the present invention is adjusted by mixing air bubbles into the film itself. The value of the water vapor transmission coefficient is considered to be about 30.0g / 24h·m2.

[0021] When the water vapor transmission coefficient is extremely low, water vapor does not pass through the reinforcement film but stays between the interface between the reinforcement film and the flexible printed circuit board due to a high temperature process such as a reflow process, causing interfacial peeling. The heat-resistant resin film with adjusted water vapor transmission coefficient is obtained by casting and coating a heat-resistant resin solution in which water vapor is mixed by stirring, followed by heating and drying. The produced film thickness is usually 12.5 to 2...

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PUM

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Abstract

The present invention aims to provide a reinforcing film for a flexible printed wiring board capable of suppressing interfacial peeling between a flexible printed wiring board and a reinforcing film that occurs in a reflow process or the like during mounting. The reinforcing film for a flexible printed wiring board according to the present invention is characterized in that it has a laminated structure made of a heat-resistant resin and includes at least one bubble-incorporated layer.

Description

technical field [0001] The present invention relates to a reinforcing film for a flexible printed circuit board used in the electronic field, in particular to a reinforcing film attached to a connection terminal portion of a flexible printed circuit board requiring a certain strength to increase strength. Background technique [0002] In recent years, along with miniaturization and high density of electronic equipment, flexible printed circuit boards in which conductive circuits are formed on flexible insulating substrates have been widely used. In this case, a flexible heat-resistant resin film is used for the insulating substrate, and reinforcements are attached to parts such as connection terminals that require strength to increase strength. [0003] Conventionally, laminates for electrical insulation such as glass-cloth-based epoxy resin laminates have been used as reinforcements. However, there are processing problems such as punching residues that are likely to occur d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/00H05K3/30
Inventor 森田亚也子关根博行鹤田隆一田中秀明
Owner NIPPON MEKTRON LTD
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