Positioning module, floor using same and heating device using the floor

A heating device and positioning mold technology, which is applied to floors, floors, building components, etc., can solve the problems of long on-site production and installation period, easy quality problems, and increased project cost of floor heating devices, so as to reduce construction costs and improve construction efficiency. Quick installation and increased space height

Inactive Publication Date: 2007-02-07
顾世安
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the complex process, the different size standards of the construction site, and the mutual influence of various cross-operations, the on-site production and installation period of the floor heating device is longer, and quality problems are prone to occur, which increases the cost of the project, and lays plastic pipes. The position of the line is quite random, which will also bring inconvenience to other construction operations such as maintenance and ground decoration in the future

Method used

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  • Positioning module, floor using same and heating device using the floor
  • Positioning module, floor using same and heating device using the floor
  • Positioning module, floor using same and heating device using the floor

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Embodiment Construction

[0021] like figure 1 , figure 2 As shown in Figure 5, the positioning die of the present invention includes a frame 1, and the lower part of the side wall of the frame 1 is provided with a notch 2 with an opening downward, and the notch 2 on the opposite side or the adjacent side in the frame 1 passes through the opening to each other. Connect the grooves below. The floor panel 11 can be made by filling the concrete layer 10 in the frame 1 and above the groove.

[0022] As shown in FIG. 6 , the heating device made of the above-mentioned floor includes a coil 12 connected to the heating device. An insulating layer is provided below the coil 2, and the insulating layers are arranged in horizontal rows and vertical columns respectively. Several floor boards 11 are laid, and coil pipes 12 are arranged in the grooves on the lower surface of each floor board 11 . The coil 12 is made of plastic pipe or copper pipe or aluminum-plastic composite pipe.

[0023] The above-mentioned ...

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PUM

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Abstract

The invention relates to a positioning module, which comprises a frame, wherein the lower part of side wall of frame has a groove whose open is downward; the grooves of opposite edges or nearby edges of frame are connected by the grooves whose opens are downward. The inventive floor is prepared by filling concrete into the groove and into the rectangle frame; and the inventive heater comprises: a coil tube connected to the heater, an insulated layer under the coil tube; said insulated layer has several floors above, whose groove of lower surface is arranged with said coil tube. The inventive module has simple transportation.

Description

technical field [0001] The invention relates to a positioning mold for heating, a floor using the positioning mold, and a heating device using the floor. Background technique [0002] According to the traditional Chinese medicine health care theory of "foot heat and head cool", the indoor temperature should be warm below and cooler above, which is beneficial to human health. Therefore, the existing building heating began to gradually adopt low-temperature floor radiant heating, but the existing low-temperature floor radiant heating usually adopts the method of fabricating and laying insulation layers, reflective layers, and laying barbed wire and plastic pipes at the construction site, and then filling them with concrete after fixing. . Due to the complex process, the different size standards of the construction site, the mutual influence of various cross operations, etc., the on-site production and installation cycle of the floor heating device is long, and quality problem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B5/48E04C2/52E04F15/00
Inventor 顾世安
Owner 顾世安
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