Photoelectric converter

A photoelectric conversion device and photoelectric conversion technology, applied in the coupling of optical waveguides, etc., can solve the problems of reduced reliability of OSA, uneven surface of contact parts, and reduced contact area, so as to improve shock resistance and thermal conductivity, and suppress electromagnetic interference , the effect of improving reliability

Inactive Publication Date: 2007-02-07
IND TECH RES INST
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Problems solved by technology

The disadvantage of this method is that due to the uneven surface of the contact part, the contact area is reduced. When encountering vibration, because the OSA is in close contact with the shell, the OSA will therefore bear a complete vibration impact, which reduces the reliability of the OSA and makes it difficult to pass through the fall. test
[0009] In addition, the OSA will generate a lot of heat when it is working. If the heat is not dissipated in real time and accumulated on the OSA, it will affect the reliability of the photoelectric conversion device and directly shorten the service life of the photoelectric conversion device.

Method used

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Embodiment 1

[0028] Figure 4 It is a structural schematic diagram of Embodiment 1 of the photoelectric conversion device of the present invention. As shown in the figure, the photoelectric conversion device 3 of the present invention at least includes: an optical sub-assembly (Optical Sub-Assembly; OSA) 31 , a circuit board 323 , a casing 32 and a conductive elastic interface unit 33 . The optical subassembly 31 is electrically connected to the circuit board 323 , which constitutes a signal processing module, and the optical subassembly 31 is equivalent to a photoelectric conversion assembly.

[0029] The optical sub-assembly 31 is an optical transmitting assembly (Transmitter Optical Sub-Assembly; TOSA) that converts electrical signals into optical signals and emits optical signals, or an optical receiving assembly for receiving optical signals and converting optical signals into electrical signals (Receive Optical Sub-Assembly; ROSA), or an optical transceiver assembly (Transmitter / Rec...

Embodiment 2

[0035] Figure 6 It is a schematic diagram of Embodiment 2 of the photoelectric conversion device of the present invention. As shown in the figure, the photoelectric conversion device 3 of Embodiment 2 is roughly the same as that described in Embodiment 1, except that the elastic interface unit 33 of Embodiment 2 It is composed of two conductive shrapnel 33a, 33b. Wherein the conductive elastic piece 33a is fixedly connected to the inner surface of the upper cover 321 and can also be integrally formed with the upper cover 321 ; the conductive elastic piece 33b is fixedly connected to the lower cover 322 and can also be integrally formed with the lower cover 322 . When the upper cover 321 and the lower cover 322 are combined, the conductive elastic piece 33a and the conductive elastic piece 33b are respectively in elastic contact with the upper and lower surfaces of the optical subassembly 31 for elastically clamping the optical subassembly 31, and Shielding the electromagneti...

Embodiment 3

[0037] Figure 7 is a schematic diagram of Embodiment 3 of the photoelectric conversion device of the present invention. As shown in the figure, the photoelectric conversion device 3 of Embodiment 3 is substantially the same as that described in Embodiment 2, except that the elastic interface unit 33 is composed of two conductive Elastic pieces 33a, 33b, and the two conductive elastic pieces 33a, 33b are fixed on the upper and lower surfaces of the optical subassembly 31, of course, it can also be integrally formed with it. When making the optical subassembly 31, the two conductive elastic pieces The elastic pieces 33a, 33b are manufactured together, so that the cost of additionally manufacturing the interface unit 33 can be omitted, and the position of the optical subassembly 31 relative to the housing can be avoided from changing when vibration, drop or drop tests are performed. That is, the optical subassembly 31 is prevented from falling off from the circuit board 323 .

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Abstract

The photoelectric converter comprises: a shell with top/bottom cover, a signal processing module in shell, a photoelectric conversion assembly, and an elastic interface unit between two covers to process signal and fix the grounding loop. This invention can shield EMI efficiently, and increases device reliability.

Description

technical field [0001] The invention relates to a photoelectric signal conversion technology, in particular to a photoelectric conversion device. Background technique [0002] Using copper wires to transmit data is transmitted in the form of electrical signals. Due to the influence of many factors such as electromagnetic radiation and heat loss, electrical signals cannot be directly transmitted for a long distance. Here, many relay stations need to be set up to continuously amplify the signal. Moreover, the transmission method of electric signals is not conducive to the confidentiality of data, thus causing potential safety hazards in systems such as banks and military units. In addition, since the bandwidth of copper wires is relatively low, the transmission capacity is also very limited. Therefore, most data and communication networks now use optical fibers instead of copper wires for so-called "optical communication". [0003] The photoelectric conversion device used in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/36G02B6/42
Inventor 林义雄郑耀龄萧正达王明传余昱辰李顺天
Owner IND TECH RES INST
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