Method and device for cleaning semiconductor crystal wafer

Abstract

A cleaning method and equipment of semiconductor wafer belongs to the equipment of wet-etching working procedure. The one group of equipment (system) relates to cankerous canal, spray advance washing canal, and stepped high and low rushing canal for the wet-etching, removing glue and cleaning in the process of semiconductor wafer production. Water from one hose cleans two groups of wafer at same time to keep the cleaning of the wafer surface. It reduces the hidden trouble of safety to working procedure and avoids the pollution of water and mark of acid. It changes the influent fashion of primary advance washing canal from bottom to brim of spray one and the water spout into the canal through the hole of the brim. It adds the spouting pressure in concentrated direction and cleans the wafer drastically to improve the wet-etching's rushing effort. The stepped high and low rushing canal is a whole, and water enters from the high end to the low end from top and bottom and saves half of water.

Description

technical field [0001] The present invention relates to a semiconductor wafer cleaning method and its cleaning equipment, specifically for flushing in processes such as wet etching, degumming, and cleaning in the production process of semiconductor wafers, and belongs to the wet etching process device of. Background technique [0002] At present, the four flushing tanks used for wet etching, degumming, cleaning and other processes in the semiconductor wafer production process are lined up and close together, from etching tank → pre-rinsing tank → two overflow tanks The troughs form a group, and the left and right groups can also be used, and a lift is installed on the corrosion tank. Each flushing tank uses a separate water inlet pipe (rear), and the N2 (nitrogen) pipe is connected to the back of the overflow tank to protect the wafers by bubbling during flushing and cleaning. The etched wafers are pre-rinsed before being further rinsed in either of the overflow tanks. Th...

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Problems solved by technology

The problems in the structure and cleaning method of this kind of flushing tank are: 1. The discs taken out from the corrosion tank must cross the top of the overflow tank to reach the pre-flushing tank after pre-flushing, and there is acid water dripping in the tank during the process. Possibly, there is a hidden danger of polluting the flushing tank; if this situation is to be avoided, the operator must deliberately bypass the top of the overflow tank, which does not conform to operating habits and brings inconvenience to actual work

2. The four water tanks are close together and have the same height. When more than two batches of discs are flushed at the same time, the overflowing water can easily overflow into the adjacent water tanks and cause mutual pollution.

3. Each flushing tank uses a separate water inlet pipe, and the amount of pure water is relatively large

4. The original pre-rinse tank enters water from the bottom and drains water through small holes at the bottom and overflow at the top, so the pre-rinse capacity for wafers is limited

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