Manufacture method for diode light-emitting device and its structure

A technology for a light-emitting device and a manufacturing method, which is applied to the manufacturing of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve the problems of complex manufacturing process and low heat dissipation efficiency of packaging structure, and achieves improved heat dissipation efficiency and increased air tightness. , the effect of good heat dissipation efficiency

Inactive Publication Date: 2007-04-25
TOP CRYSTAL TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The main technical problem to be solved by the present invention is to improve the known packaging structure of light-emitting

Method used

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  • Manufacture method for diode light-emitting device and its structure
  • Manufacture method for diode light-emitting device and its structure
  • Manufacture method for diode light-emitting device and its structure

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[0091] In order to further illustrate the purpose, structural features and functions of the present invention, detailed descriptions are as follows in conjunction with related embodiments and drawings:

[0092] The present invention is a manufacturing method and structure of a diode light emitting device 30. The structure of the diode light emitting device 30 is to use a metal material with good thermal conductivity to manufacture the body 41, 41' of the diode light emitting device 30 to greatly increase the heat dissipation area. Therefore, the diode chip 50 of the diode light emitting device 30 can obtain a better heat dissipation effect during operation.

[0093] FIG. 2 shows a three-dimensional implementation diagram of a diode light emitting device 30 of the present invention. FIG. 3 is a cross-sectional view of an embodiment of a diode light emitting device 30 of the present invention along the cross-sectional line of FIG. 2A-A. The diode light emitting device 30 of this emb...

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Abstract

The invention relates to a method for producing diode lighting device and relative structure. Wherein, said method comprises that combining the base with diode chip, wire setting and covered lighting layer on the mould filled with lens resin, or setting at least two pour holes on the base to combine the base and mould; then filling the lens resin via said pour holes into the mould. The invention can effectively improve the combine efficiency between lens and base; and the main body of lighting device is made from metal with better thermal conductivity, to improve radiate area.

Description

technical field [0001] The present invention relates to a method for manufacturing a diode light-emitting device and its structure, in particular to a method for manufacturing a diode light-emitting device that enables a more effective combination of a lens and a base structure, and a method for making the diode light-emitting device have a better heat dissipation effect Diode light emitting device structure. Background technique [0002] Light Emitting Diode (Light Emitting Diode; LED) With the advancement of material technology, the progress of light emitting color and brightness is no longer comparable. Various light emitting diode display technologies have approached full color and high brightness, and light emitting diodes are more promising. Become a new era lighting equipment that illuminates human life. [0003] In recent years, the continuous improvement of product characteristics such as light-emitting diode luminous efficiency has led to a substantial increase in...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L25/075H01L23/28H01L23/36H01L21/50H01L33/64
CPCH01L2224/48091H01L2224/48247H01L2224/48465
Inventor 陈明鸿
Owner TOP CRYSTAL TECH
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