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Barrier diaphragm supporting disc

A technology for supporting disks and diaphragms, which is applied in the direction of grinding devices, surface polishing machine tools, grinding machine tools, etc., can solve the problems of uneven grinding of silicon wafers, and achieve the effects of improving uneven grinding, simple structure, and improved grinding effect

Inactive Publication Date: 2007-05-30
SHANGHAI HUA HONG NEC ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a diaphragm support plate, which can improve the problem of uneven grinding of silicon wafers at low cost, thereby improving the production efficiency and product quality of products

Method used

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  • Barrier diaphragm supporting disc
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Embodiment Construction

[0014] Fig. 3 is the structure of the existing grinding head, a diaphragm support disc 1 is installed at its lower part, a circle of retaining ring 2 is arranged around the diaphragm support disc 1, and an inner pipe 3 is also provided inside the grinding head. When working, the silicon chip is located inside the retaining ring 2, and the through hole on the diaphragm support plate communicates with the inner tube, and the inner tube controls the pressure of the internal gas. When working, the pressure of the gas inside the diaphragm support plate decreases, so that the silicon wafer is adsorbed on the lower surface of the diaphragm support plate to achieve a fixed effect.

[0015] The structure of the diaphragm support plate of the present invention is shown in Figure 2 and Figure 3, and its shape is disc-shaped. There are a plurality of through holes 6 perpendicular to the surface of the disc inside the diaphragm support disc, and the lower surface of the diaphragm support di...

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Abstract

The round diaphragm support disk has several through holes vertical to the round plate surface, a diaphragm support plate cushion at the lower surface of the diaphragm support plate, a diaphragm layer under the cushion extending upward surrounding the side of the diaphragm support plate, with the center of the round plate has a convex in the middle. It improves grinding effect with smoother grinding. It is simple, easy to realize with improved efficiency and product quality.

Description

technical field [0001] The invention relates to a device for semiconductor chemical mechanical polishing, in particular to a supporting device for semiconductor chemical mechanical polishing. Background technique [0002] With the continuous development of semiconductor technology, the integration of devices is getting higher and higher, so the number of wiring layers of devices is getting more and more, and the line width is getting smaller and smaller. Therefore, the requirements of the device on the planarization effect and uniformity of the interlayer film are also continuously increasing. TITAN 2 grinding head came into being. It is through the pressure control of 4 chambers (chambers), which better realizes the effect of CMP (chemical mechanical polishing) planarization. However, because the price of this grinding head is too high, which is 3 to 4 times higher than that of the common TITAN 1 grinding head, and the application range is only limited to 12-inch semicond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04B24B29/02B24B37/27
Inventor 蔡晨
Owner SHANGHAI HUA HONG NEC ELECTRONICS