Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat radiator

A heat dissipation device and heat technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problems of condensation and lifespan not being well guaranteed, so as to save electric energy and improve service life , to avoid the effect of condensation phenomenon

Inactive Publication Date: 2007-05-30
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF1 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the above-mentioned semiconductor CPU heat sink 100 has improved heat dissipation efficiency, yet, its described heat shield 160 can be in the alternation state that cold and hot temperature differs greatly when CPU130 works, so just be difficult to guarantee heat shield 160 and heat conductor Always maintain good contact between 140, if the contact is poor, it is easy to cause condensation at low temperature
This semiconductor CPU radiator 100 can make CPU130 work in the state of lower temperature all the time when working, but the lower the temperature is not necessarily the better for CPU130, and described semiconductor refrigerator 150 also is uninterrupted work when CPU130 works , so that its life will not be well guaranteed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat radiator
  • Heat radiator
  • Heat radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] Please refer to FIG. 2 and FIG. 3 together. The heat dissipation device 200 of the present invention is used to dissipate heat to a heat-generating electronic component, such as a central processing unit 230. Its preferred embodiment includes a fan 210, a radiator 220, a heat conductor 240, a Semiconductor refrigerator 250, a sensor, and a temperature controller 280 (the temperature controller 280 can be arranged on the available space of the motherboard), and the sensor includes a first sensing element 260 and a second sensing element 270 .

[0013] Wherein, the central processing unit 230 is in close contact with one side of the heat conductor 240 (usually with heat dissipating paste between the two), and the other side of the heat conductor 240 is in close contact with the heat-absorbing side of the semiconductor refrigerator 250, and the first heat conductor Both the sensing element 260 and the second sensing element 270 are in close contact with the heat conductor ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention relates to dissipation device, which is to dissipate heat of electron parts and comprises one conductor, one semiconductor cooling device, one sensor and one temperature controller, wherein, the said conductor is to absorb the heat of electron; the said semiconductor cooling is to transfer heat to outside; the said sensor is to monitor heat electron temperature to feed back temperature data through sensor; the temperature controller is to control cooling status to control the electron part temperature.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a device for cooling heat-generating electronic components. 【Background technique】 [0002] In a computer system or a server system, for heat-generating electronic components, such as a central processing unit (Central Processing Unit, CPU), a heat sink is usually used for heat dissipation and cooling. The existing CPU heat sink is mainly through direct contact with the CPU. The heat sink draws the heat out, and then uses the fan to blow the air to flow and carry the heat away. However, the heat sink of this CPU heat sink directly contacts with the CPU, and the temperature difference between it and the air is not large, so that the heat dissipation effect is not very good. If the ambient temperature is too high, the heat dissipation effect will be even worse, and it is easy to Lead to system slowdown, crash, burn CPU and other consequences. [0003] Please refer to Fig. 1, Chinese...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/34H01L23/38G06F1/20H05K7/20
Inventor 游永兴何凤龙王进波
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com