Heat radiator

A heat dissipation device and heat technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problems of condensation and lifespan not being well guaranteed, so as to save electric energy and improve service life , to avoid the effect of condensation phenomenon

Inactive Publication Date: 2007-05-30
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0004] Although the above-mentioned semiconductor CPU heat sink 100 has improved heat dissipation efficiency, yet, its described heat shield 160 can be in the alternation state that cold and hot temperature differs greatly when CPU130 works, so just be difficult to guarantee heat shield 160 and heat conductor Always maintain good contact between 140, if the contact is poor,

Method used

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Example Embodiment

[0012] Please refer to FIG. 2 and FIG. 3 together. The heat dissipation device 200 of the present invention is used to dissipate heat to a heat-generating electronic component, such as a central processing unit 230. Its preferred embodiment includes a fan 210, a radiator 220, a heat conductor 240, a Semiconductor refrigerator 250, a sensor, and a temperature controller 280 (the temperature controller 280 can be arranged on the available space of the motherboard), and the sensor includes a first sensing element 260 and a second sensing element 270 .

[0013] Wherein, the central processing unit 230 is in close contact with one side of the heat conductor 240 (usually with heat dissipating paste between the two), and the other side of the heat conductor 240 is in close contact with the heat-absorbing side of the semiconductor refrigerator 250, and the first heat conductor Both the sensing element 260 and the second sensing element 270 are in close contact with the heat conductor ...

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Abstract

This invention relates to dissipation device, which is to dissipate heat of electron parts and comprises one conductor, one semiconductor cooling device, one sensor and one temperature controller, wherein, the said conductor is to absorb the heat of electron; the said semiconductor cooling is to transfer heat to outside; the said sensor is to monitor heat electron temperature to feed back temperature data through sensor; the temperature controller is to control cooling status to control the electron part temperature.

Description

【Technical field】 [0001] The invention relates to a heat dissipation device, in particular to a device for cooling heat-generating electronic components. 【Background technique】 [0002] In a computer system or a server system, for heat-generating electronic components, such as a central processing unit (Central Processing Unit, CPU), a heat sink is usually used for heat dissipation and cooling. The existing CPU heat sink is mainly through direct contact with the CPU. The heat sink draws the heat out, and then uses the fan to blow the air to flow and carry the heat away. However, the heat sink of this CPU heat sink directly contacts with the CPU, and the temperature difference between it and the air is not large, so that the heat dissipation effect is not very good. If the ambient temperature is too high, the heat dissipation effect will be even worse, and it is easy to Lead to system slowdown, crash, burn CPU and other consequences. [0003] Please refer to Fig. 1, Chinese...

Claims

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Application Information

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IPC IPC(8): H01L23/34H01L23/38G06F1/20H05K7/20
Inventor 游永兴何凤龙王进波
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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