Adhesive chuck device

Abstract

The invention aims to surely mount and remove a board by a pneumatic mechanism having a simple structure. On a board side of a holding board (1), a movable film (3) which can be deformed in a direction intersecting with a board side plane (1a) in an opening part (1b) provided on the board side plane (1a), and an adhesive member (4) for holding a board (A) by adhesion by facing the board are provided. By reciprocating the movable film (3) by a pressure difference between a primary side space (5) and a secondary side space (S) of the movable film (3), an adhesive surface (4a) of the adhesive member (4) is permitted to abut to the board (A) to hold the board by adhesion, the adhesive surface and the board are forcibly separated and the board (A) is smoothly peeled from the adhesive surface (4a) of the adhesive member (4).

Description

technical field [0001] The present invention relates to an adhesive chuck device used in a substrate assembly device including a substrate bonding machine used in, for example, a liquid crystal display (LCD) or a plasma display (PDP), etc. In the manufacturing process of flat panel displays, glass substrates such as CF glass and TFT glass or synthetic resin substrates are bonded and held together. [0002] In detail, it relates to a bonding chuck device for detachably holding a substrate by bonding to a holding plate. Background technique [0003] Conventionally, in a substrate bonding machine that overlaps two substrates, the substrate is held by an electrostatic chuck. However, with the increase in the size of the substrate in recent years, it is difficult to manufacture a large-sized electrostatic chuck, and even if it can be manufactured, the cost It will also be very high. [0004] Then, in order to solve these problems, there is an adhesive chuck device that uses an ...

AI Technical Summary

Problems solved by technology

[0012] However, in such a conventional adhesive chuck device, in the case of Patent Document 1, there is a problem that in order to peel off the adhesive member and the substrate, the adhesive sheet must be rolled up and pressed against the roll. The speed is synchronized with the speed so that it moves horizontally in the same winding direction, or the tool table and the tool base must be raised to pass the tool to cut the adhesive sheet. Each action requires multiple driving sources such as motors or actuators, resulting in structural complication

[0013] Furthermore, in the case of Patent Document 2, in order to raise the bonding member in the opening of the pressure plate, a plurality of actuators are required for each bonding member, while in the case of Patent Document 3, each Each bonding member requires a rotation actuator and an actuator for driving up and down to move the bonding member back while rotating, respectively, resulting in a complicated structure.

[0014] Therefore, Patent Documents 1 to 3 not only have a high incidence of failure due to the complicated peeling structure, but also have the following problems, that is, especially when they are arranged in a substrate assembly device or a substrate transfer device including a substrate bonding machine, etc. , it is difficult to replace the original electrostatic chuck and other substrate holding mechanisms with the bonding chuck device of the present invention

[0015] Moreover, there is a problem that when the above-mentioned actuator is an electromagnetic motor such as a motor, it will easily generate heat. For example, a substrate made of glass is sensitive to thermal changes, and it will shrink by about 4 μmm with only a change of 1°C. Due to this effect, it is difficult to align the substrates correctly with respect to each other

[0016] And there is also the following problem, that is, when the adhesive is held in an ambient gas from atmospheric pressure to a predetermined degree of vacuum, and when the adhesion is peeled off and opened, the change from atmospheric pressure to a predetermined degree of vacuum, but if the motor is used If there is an electromagnetic actuator in the vacuum, at some point in the vacuum there may be a plasma discharge, which will lead to the destruction of the glass plate

[0017] Moreover, there is a problem that, even if the above-mentioned actuator is a driving source such as a cylinder, it is difficult to downsize because it has a sealed structure that can operate telescopically, so that the entire device becomes large and causes an increase in manufacturing cost.

[0018] However, especially large-scale substrates are prone to distortion and deformation. In order to firmly bond and hold such easily deformable substrates and open and peel them off, it is necessary to use a strong force to make the bonding parts contact or separate the substrates. In order to obtain such a strong force The actuator must be upsized, resulting in a heavier weight

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