Adhesive chuck device

A technology for chucks and substrates, applied in identification devices, nonlinear optics, optics, etc., can solve problems such as increased manufacturing costs, high failure rates, glass plate damage, etc., to avoid the risk of impact or discharge, and the failure rate Lowered, safe and correct alignment effect

Inactive Publication Date: 2007-06-20
SHIN ETSU ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, in such a conventional adhesive chuck device, in the case of Patent Document 1, there is a problem that in order to peel off the adhesive member and the substrate, the adhesive sheet must be rolled up and pressed against the roll. The speed is synchronized with the speed so that it moves horizontally in the same winding direction, or the tool table and the tool base must be raised to pass the tool to cut the adhesive sheet. Each action requires multiple driving sources such as motors or actuators, resulting in structural complication
[0013] Furthermore, in the case of Patent Document 2, in order to raise the bonding member in the opening of the pressure plate, a plurality of actuators are required for each bonding member, while in the case of Patent Document 3, each Each bonding member requires a rotation actuator and an actuator for driving up and down to move the bonding member back while rotating, respectively, resulting in a complicated structure.
[0014] Therefore, Patent Documents 1 to 3 not only have a high incidence of failure due to the complicated peeling structure, but also have the following problems, that is, especially when they are arranged in a substrate assembly device or a substrate transfer device including a substrate bonding machine, etc. , it is difficult to replace the original electrostatic chuck and other substrate holding mechanisms with the bonding chuck device of the present invention
[0015] Moreover, there is a problem that when

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0111] Example 1

[0112] This embodiment 1 shows the following situation as shown in Figure 1 (a) to (c), namely, only the holding surface 1a of the upper holding plate 1 is provided with a plurality of openings 1b to support the outer peripheral portion of the movable membrane 3 A rigid body portion 3a is provided on a part of the movable film 3 facing the surface A1 of the substrate A, and at the same time, a ring-shaped adhesive is fixed along the opening edge of each opening 1b located on the secondary side than the movable film 3 The binding member 4 is in a state where the rigid body portion 3a moves upward and enters the opening 1b, and the binding member 4 is brought into contact with the upper substrate A and held by bonding, and the movable film 3 is moved toward the secondary side. The space (closed space) S protrudes and deforms downward, and the substrate A bonded and held on the bonding surface 4a of the bonding member 4 is forcibly peeled off.

[0113] Moreover, in...

Example Embodiment

[0139] Example 2

[0140] This embodiment 2 is shown in Figures 3(a) to (d), and is provided with an air passage 6a penetrating along the reciprocating direction of the movable membrane 3, and vacuum suction is performed from the air passage 6a and supplied with, for example, nitrogen gas. When the vacuum suction mechanism 6 constituted by the gas supply source 6b, when the upper substrate A is installed, vacuum suction is performed from the air passage 6a of the vacuum suction mechanism 6 to adsorb and hold the upper substrate A, and then peeled from the adhesive member 4 as necessary A gas such as nitrogen gas is sprayed from the air passage 6a to the surface A1 of the upper substrate A. This structure is different from the first embodiment shown in FIGS. 1 to 2 and the other structure is the same as the first embodiment.

[0141]In the example shown in the figure, the air passage 6a is penetrated so as to penetrate the movable membrane 3 and the rigid body portion 3a provided o...

Example Embodiment

[0149] Example 3

[0150] As shown in Figure 4(a) to (c), the third embodiment does not provide the fixed position of the bonding member 4 at the opening edge of the opening 1b, but is provided in a protruding manner on the movable film. 3 The front end surface of the rigid body part 3a of the central part, and at the same time, the pressure difference between the primary space (pneumatic chamber) 5 and the secondary space (closed space) S of the movable membrane 3, the adhesion of the adhesive member 4 In a state where the bonding surface 4a and the holding surface 1a are approximately the same surface or slightly (about 100μm) protruding convexly, the bonding surface 4a of the bonding member 4 abuts the upper substrate A for bonding and holding. In addition, by making The movable film 3 deforms upward toward the primary space (pneumatic chamber) 5 and enters the opening 1b in a concave shape, thereby forcibly peeling the bonding surface 4a of the bonding member 4 from the upper ...

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PUM

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Abstract

The invention aims to surely mount and remove a board by a pneumatic mechanism having a simple structure. On a board side of a holding board (1), a movable film (3) which can be deformed in a direction intersecting with a board side plane (1a) in an opening part (1b) provided on the board side plane (1a), and an adhesive member (4) for holding a board (A) by adhesion by facing the board are provided. By reciprocating the movable film (3) by a pressure difference between a primary side space (5) and a secondary side space (S) of the movable film (3), an adhesive surface (4a) of the adhesive member (4) is permitted to abut to the board (A) to hold the board by adhesion, the adhesive surface and the board are forcibly separated and the board (A) is smoothly peeled from the adhesive surface (4a) of the adhesive member (4).

Description

technical field [0001] The present invention relates to an adhesive chuck device used in a substrate assembly device including a substrate bonding machine used in, for example, a liquid crystal display (LCD) or a plasma display (PDP), etc. In the manufacturing process of flat panel displays, glass substrates such as CF glass and TFT glass or synthetic resin substrates are bonded and held together. [0002] In detail, it relates to a bonding chuck device for detachably holding a substrate by bonding to a holding plate. Background technique [0003] Conventionally, in a substrate bonding machine that overlaps two substrates, the substrate is held by an electrostatic chuck. However, with the increase in the size of the substrate in recent years, it is difficult to manufacture a large-sized electrostatic chuck, and even if it can be manufactured, the cost It will also be very high. [0004] Then, in order to solve these problems, there is an adhesive chuck device that uses an ...

Claims

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Application Information

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IPC IPC(8): G09F9/00G02F1/13
CPCG02F1/1333G02F1/13
Inventor 横田道也大谷义和板下光邦
Owner SHIN ETSU ENG
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