X-ray detecting method for printed circuit board defect

Abstract

The intelligent analysis method, the intelligent system, and method for controlling position of X light source are in use for checking products of print circuit board (PCB). Defect recognition algorithm raises accuracy of recognition, and lowers erroneous judgment of false defect. Through user's main threaded, threaded of background operator, and monitoring threaded of serial port, the disclosed intelligent system at PC end, as well as PLC communication and control multithreading implements coordinational synchronization between PC intelligent system and PLC. Since penetrability of X ray, percentage of coverage for detecting defective workmanship of PCB by system is raised greatly.

Description

technical field [0001] The invention relates to a detection method for defects of an assembled printed circuit board (PCBA), in particular to an X-ray detection method for defects of a printed circuit board. Background technique [0002] With the rapid development of electronic technology, the miniaturization of packaging and the high density of assembly, as well as the continuous emergence of various new packaging technologies, the requirements for the quality of electronic assembly are also getting higher and higher. Therefore, higher requirements are put forward for inspection methods and techniques. At present, there are many kinds of testing technologies used in the field of electronic assembly testing, such as manual visual inspection (MVI), online testing (ICT), automatic optical testing (AOI), automatic X-ray testing (AXI), and functional testing (FT). Wait. These detection methods have their own advantages and disadvantages. [0003] Different testing techniques ...

AI Technical Summary

Problems solved by technology

However, the AOI system also has shortcomings, such as the inability to detect circuit errors, and the detection of the internal conditions of invisible solder joints is also powerless

[0008] The prior art has the following deficiencies in the detection technology of printed circuit boards: it is impossible to detect invisible solder joints, such as ball grid array packaging BGA, etc., so that some physical defects that are invisible to the naked eye will bring problems to printed circuit boards. Hidden dangers in quality; image processing and recognition technology cannot be used to quickly identify a large number of connections and solder joints on printed circuit boards for qualitative and quantitative analysis to improve detection speed and reliability of quality control

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