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Lead free solder alloy and its preparation method

A technology of lead-free solder alloy and master alloy, applied in the field of metallurgy

Inactive Publication Date: 2007-07-04
上海飞轮有色冶炼厂
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the current prior art has not yet developed a substantial alternative product that is lead-free but maintains the excellent performance of solder

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Example 1 Preparation of lead-free solder alloy 1

[0025] Prepare a lead-free solder alloy, which is composed of silver, copper, tin and mixed rare earth Re, and the components are: Ag 4%, Cu 1.2%, mixed rare earth Re 0.05%, Ce 0.05%, and the balance is Sn .

[0026] When preparing lead-free solder alloys, firstly accurately weigh each element according to the aforementioned ratio, and then proceed to specific preparation through the following steps: produce Sn-Re1% rare earth master alloy at 500-600°C, the weight percentage of mixed rare earth Re 1%, the rare earth master alloy is added to the container with the remaining 60%-70% of Sn weight and all Ag and Cu, and the temperature is raised to 550°C. After it is completely melted, add the rare earth master alloy prepared above and fully melt. Add the remaining tin, fully melted, stir evenly and cast into lead-free solder alloy.

Embodiment 2

[0027] Example 2 Preparation of lead-free solder alloy 2

[0028] Prepare a lead-free solder alloy, which includes silver, copper, tin, and mixed rare earth Re, and the components are: Ag 7%, Cu1.2%, mixed rare earth Re 0.2%, and the balance is Sn .

[0029] When preparing lead-free solder alloys, firstly accurately weigh each element according to the aforementioned ratio, and then carry out specific preparation through the following steps: produce Sn-Re1% rare earth master alloy at 500-600 ° C, the weight percentage of mixed rare earth Re The remaining Sn and all the Ag and Cu of the rare earth master alloy are added to the container, and the temperature is raised to about 550°C. After it is completely melted, add the rare earth master alloy prepared above, fully melt, add the remaining tin, after fully melt, stir evenly and cast into lead-free solder alloy.

Embodiment 3

[0030] Embodiment 3 An example of producing 1000g lead-free solder alloy and steps thereof:

[0031] (1) First weigh 396g Sn, 4g mixed rare earth Re to prepare 400g Sn-Re rare earth master alloy, then weigh 50g Ag, 8g Cu, 362g Sn, 180g Sn respectively;

[0032] (2) Put 362g Sn, 50g Ag and 8g Cu into the pot, heat to 540°C-560°C and stir until all melted;

[0033] (3) Add 400g Sn-Re master alloy in the pot, continue heating and stirring until all melted;

[0034] (4) Continue to add 180g of Sn into the pot until it is completely melted, stir evenly and cast into lead-free solder alloy.

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PUM

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Abstract

The invention discloses a lead-free welding materials alloy which consists of silver, copper, tin and mixed rare earth Re, and the weight percentage of the composition is: Ag 3 ~ 8%, Cu 0.1 ~ 1.0%, mixed rare earth Re 0.01 ~ 0. 5% and cushion is Sn. The invention also discloses the preparation method of said lead-free welding materials alloy. The lead-free welding materials alloy in the invention can be widely used in welding materials of various circuit boards, components and assembly production line. The lead-free welding materials alloy in the invention has excellent rollout performance, low melting point but high environmental protection, and does not generate low melting point eutectic composition; it is conducive to forming reliable welding joints in welding process.

Description

technical field [0001] The invention relates to the field of metallurgy, in particular to a lead-free solder alloy and a manufacturing method thereof. The solder alloy can be widely used as welding raw materials for various circuit boards, components and assembly lines. Background technique [0002] In the past, solders used for electrical connection of electronic product components mostly used brazing alloys containing a large amount of lead. However, lead is a non-degradable toxic metal element. With the rapid development of science and technology and the strengthening of environmental protection awareness, people pay more and more attention to the problem of lead and its compounds polluting the environment and endangering human health. Therefore, the call for lead-free solder to replace lead solder in areas closely related to people's lives is increasing, and developed countries such as the United States, Europe, and Japan have enacted legislation to promote lead-free so...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/03
Inventor 沈嘉麟顾秀峰吴建华张忠民韩鹰孙飞朱卫敏黄惠民
Owner 上海飞轮有色冶炼厂
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