Camera module package

Abstract

The invention relates to a camera module package including a lens barrel having at least one lens therein and an IR filter installed at a lower end thereof. The package also includes a housing having the lens barrel disposed movable in an optical axis direction in an inner hole thereof. The package additionally includes a ceramic substrate attached to a lower end of the housing, the ceramic substrate having an opening formed on an upper surface thereof corresponding to the position of the lens. The package further includes an image sensor electrically connected to a lower part of the ceramic substrate, the image sensor having an image sensing region thereof exposed through the opening of the ceramic substrate. This prevents damaging the components by the adhesive leaking during the assembly, defective products due to infiltration of extraneous material, improves product reliability and reduces manufacturing costs.

Description

[0001] This application claims the benefit of Korean Patent Application No. 2005-0130422 filed with the Korean Intellectual Property Office on December 27, 2005, the contents of which are hereby incorporated by reference. technical field [0002] The present invention relates to a camera module package, and more particularly, to a camera module package that simplifies the assembly process with fewer components therein, prevents the ingress of foreign matter to avoid defective images, and achieves high quality image, and achieve miniaturization with reduced volume. Background technique [0003] Currently, many mobile terminal manufacturers are developing and mass-producing mobile terminals with camera module packages. Camera module packages installed in mobile terminals are developed in various forms according to components and packaging methods. [0004] Generally, camera module packages are mainly classified into chip-on-fi...

AI Technical Summary

Problems solved by technology

[0017] However, when the FPCB 30 and the image sensor 40 are combined by coating a liquid polymer adhesive and heat pressing, the manufacturing process is complicated and cumbersome.

[0018] In addition, when foreign substances penetrate into the IR filter 25 of the housing 20 mounted on the FPCB 30 or into the image sensor 40, it is difficult to clean the image sensor 40 to remove the foreign substances, thereby deteriorating the image quality of the camera module. Difference

[0019] Moreover, providing a separate connector 35 and fitting to the other end of the FPCB 30 increases the number of components while limiting the reduction in volume of the package.

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