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Exposure device, substrate processing apparatus, exposure method of substrate and substrate processing method

a technology of substrate processing and exposure device, which is applied in the direction of photomechanical equipment, instruments, transportation and packaging, etc., can solve the problems of lowering the efficiency of the exposure processing of the substrate for a long time, and achieve the effect of lowering the efficiency of the exposure processing of the substra

Active Publication Date: 2019-09-03
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006]During the exposure processing, when oxygen is present in the paths of the vacuum ultraviolet rays emitted to the substrate, oxygen molecules that receive the vacuum ultraviolet rays are separated into oxygen atoms, and the separated oxygen atoms are recoupled with other oxygen molecules. Thus, ozone is generated. In this case, the vacuum ultraviolet rays that reach the substrate are attenuated. As such, in JP 2016-183990 A, gas in the casing of the exposure device is discharged such that oxygen concentration during the exposure processing is lowered to a value equal to or lower than 1%. However, it requires a long period of time to discharge oxygen molecules, so that efficiency of the exposure processing for the substrate is lowered.
[0007]An object of the present invention is to provide an exposure device capable of improving efficiency of exposure processing for a substrate, a substrate processing apparatus in which the efficiency of the exposure processing for the substrate can be improved, and an exposure method and a substrate processing method by which the efficiency of the exposure processing for the substrate can be improved.
[0008](1) An exposure device according to one aspect of the present invention includes a processing chamber that stores a substrate having a film that has been formed on a surface to be processed, a light source provided to be emittable of vacuum ultraviolet rays to the substrate stored in the processing chamber, a gas discharger that discharges an atmosphere in the processing chamber, an oxygen concentration meter that measures oxygen concentration in the processing chamber, an illuminometer that receives part of the vacuum ultraviolet rays and measures illuminance of the received vacuum ultraviolet rays during an emission period in which the vacuum ultraviolet rays are emitted from the light source to the substrate, an exposure amount calculator that calculates an exposure amount of the substrate based on the illuminance measured by the illuminometer, and a light source controller that controls the light source such that emission of the vacuum ultraviolet rays by the light source to the substrate is started at a time point at which the oxygen concentration measured by the oxygen concentration meter is lowered to predetermined exposure starting concentration, and controls the light source such that the emission of the vacuum ultraviolet rays by the light source to the substrate is stopped at a time point at which the exposure amount calculated by the exposure amount calculator is increased to a predetermined set exposure amount, wherein the exposure starting concentration is defined in advance to be higher than 1% and lower than oxygen concentration in air, and is defined such that ozone generated from oxygen atoms by the emission of the vacuum ultraviolet rays does not damage the film on the surface to be processed of the substrate.

Problems solved by technology

However, it requires a long period of time to discharge oxygen molecules, so that efficiency of the exposure processing for the substrate is lowered.

Method used

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  • Exposure device, substrate processing apparatus, exposure method of substrate and substrate processing method
  • Exposure device, substrate processing apparatus, exposure method of substrate and substrate processing method
  • Exposure device, substrate processing apparatus, exposure method of substrate and substrate processing method

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first embodiment

[0051][1] First Embodiment

[0052](1) Configuration of Exposure Device

[0053]The exposure device, a substrate processing apparatus, an exposure method and a substrate processing method according to the first embodiment of the present invention will be described below with reference to drawings. In the following description, a substrate refers to a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disc, a substrate for a magnetic disc, a substrate for a magneto-optical disc, a substrate for a photomask, a substrate for solar cells or the like.

[0054]FIG. 1 is a schematic cross sectional view showing a configuration of the exposure device according to the first embodiment of the present invention. As shown in FIG. 1, the exposure device 100 includes a controller 110, a processing chamber 120, a closer 130, a receiver-transferer 140, a lifter-lowerer...

second embodiment

[0127][2] Second Embodiment

[0128]As for an exposure device and a substrate processing apparatus according to the second embodiment, differences from the exposure device and the substrate processing apparatus according to the first embodiment will be described. FIG. 17 is a cross sectional perspective view of the exposure device in the second embodiment of the present invention. FIG. 18 is a longitudinal cross sectional view of the exposure device 100 of FIG. 17. In FIGS. 17 and 18, part of the constituent elements is not shown in order to facilitate understanding of an inner configuration of the exposure device 100.

[0129]As shown in FIG. 18, in the exposure device 100 according to the present embodiment, an illuminometer 183 is fixed to an inner surface of a casing 121 by a fixing member 124. The illuminometer 183 is arranged to overlap with a portion in the vicinity of one corner of a light-transmitting plate 162 when seen in plan view, and the illuminometer 183 is arranged such th...

third embodiment

[0133][3] Third Embodiment

[0134]As for an exposure device and a substrate processing apparatus according to the third embodiment, differences from the exposure device and the substrate processing apparatus according to the first embodiment will be described. FIG. 19 is a cross sectional perspective view of the exposure device in the third embodiment of the present invention. FIG. 20 is a longitudinal cross sectional view of the exposure device 100 of FIG. 19. In FIGS. 19 and 20, part of the constituent elements is not shown in order to facilitate understanding of an inner configuration of the exposure device 100.

[0135]As shown in FIGS. 19 and 20, the exposure device 100 according to the present embodiment includes a light blocker 190B instead of the light blocker 190 of FIG. 3. The light blocker 190B has a configuration similar to that of the light blocker 190 of FIG. 3 except that the light blocking member 191 is not included. A support member 194 supports an illuminometer 183 by o...

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Abstract

An atmosphere in a processing chamber in which a substrate is stored is discharged by a suction device. At a time point at which oxygen concentration in the processing chamber is lowered to predetermined exposure starting concentration, emission of vacuum ultraviolet rays from a light source to the substrate is started. The emission of the vacuum ultraviolet rays to the substrate is stopped at a time point at which the exposure amount of the substrate increases to a predetermined set exposure amount. The exposure starting concentration is defined in advance to be higher than 1% and lower than oxygen concentration in the air, and is defined in advance such that ozone generated from oxygen atoms by the emission of the vacuum ultraviolet rays do not damage the film on the surface to be processed of the substrate.

Description

BACKGROUND OF THE INVENTION[0001]Field of the Invention[0002]The present invention relates to an exposure device, a substrate processing apparatus, an exposure method of a substrate and a substrate processing method for performing exposure processing on the substrate.[0003]Description of Related Art[0004]In recent years, a photolithography technique utilizing Directed Self Assembly (DSA) of a block copolymer has been developed in order to realize a finer pattern formed on a substrate. In such a photolithography technique, heating processing is performed on the substrate to which a block polymer has been applied, and then one surface of the substrate is exposed. Thus, the block polymer is reformed. In this processing, it is required that an exposure amount of the substrate is accurately adjusted.[0005]In JP 2016-183990 A, an exposure device that exposes a film (DSA film), including a Directed Self Assembly, on a substrate is described. The exposure device has a light emitter that can...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): G03F7/20G03F7/16H01L21/027G03F7/00B81C1/00H01L21/687H01L21/311H01L21/67H01L21/677
CPCG03F7/7055G03F7/0002G03F7/168G03F7/2004G03F7/70008G03F7/70558G03F7/70858G03F7/70933H01L21/31133H01L21/67115H01L21/67253H01L21/67748H01L21/68742B81C1/00H01L21/0274G03F7/70775H01L21/67017H01L21/67098H01L21/027
Inventor MATSUO, TOMOHIROFUKUMOTO, YASUHIROOKI, TAKAFUMIASAI, MASAYAHARUMOTO, MASAHIKOTANAKA, YUJINAKAYAMA, CHISAYO
Owner DAINIPPON SCREEN MTG CO LTD