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Micro-LED display panel and manufacturing method thereof

a technology of light-emitting diodes and display panels, which is applied in the field of display panels, can solve problems such as affecting the reliability of micro-led display panels obtained in subsequent processes, and achieve the effect of good reliability

Active Publication Date: 2020-09-15
PLAYNITRIDE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The anisotropic conductive film effectively prevents micro-LED damage and breakage during the bonding process, enhancing the reliability and structural integrity of the micro-LED display panel by ensuring proper electrical connection and structural strength.

Problems solved by technology

However, in the transfer process, the micro-LEDs may be damaged easily or even break, which impairs the reliability of the micro-LED display obtained in the subsequent processes.

Method used

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  • Micro-LED display panel and manufacturing method thereof
  • Micro-LED display panel and manufacturing method thereof
  • Micro-LED display panel and manufacturing method thereof

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first embodiment

[0036]FIG. 1A is a partial cross-sectional diagram of a micro-LED display panel according to the invention. Referring to FIG. 1, in this embodiment, a micro-LED display panel 100 includes a substrate 110, an anisotropic conductive film 120, and a plurality of micro-LEDs 130, wherein the substrate 110 may be a driving circuit substrate, and a driving circuit (not shown) and a plurality of pads 112 electrically connected to the driving circuit (not shown) are disposed on a surface 111 of the substrate 110.

[0037]The anisotropic conductive film 120 is disposed at a side of the substrate 110. That is, the anisotropic conductive film 120 is disposed on the surface 111 of the substrate 110 and covers the pads 112. The anisotropic conductive film 120 includes an insulation film 121 and a plurality of conductive particles 122, wherein the insulation film 120 may be formed of a resin, and the conductive particles 122 are dispersed in the insulation film 121. The micro-LEDs 130 and the anisotr...

fifth embodiment

[0062]FIG. 5 is a partial cross-sectional diagram of a micro-LED display panel according to the invention. Referring to FIG. 5, a difference between a micro-LED display panel 100D of this embodiment and the micro-LED display panels 100A to 100C of the embodiments described above lies in that: in this embodiment, the bonding layer 132 has at least two different thicknesses, and for example, a cross-sectional shape of the micro-LED 130b is an inverted trapezoidal shape, and the micro-LEDs 130b may include red light micro-LEDs, green light micro-LEDs, and blue light micro-LEDs, wherein a thickness of the red light micro-LED is greater than a thickness of the green light micro-LED, and the thickness of the green light micro-LED is greater than a thickness of the blue light micro-LED, for example. Nevertheless, the invention is not intended to limit the red light micro-LED, the green light micro-LED, and the blue light micro-LED to certain cross-sectional shapes, nor limit the thickness ...

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Abstract

A micro-LED display panel including a substrate, an anisotropic conductive film, and a plurality of micro-LEDs is provided. The anisotropic conductive film is disposed on the substrate. The micro-LEDs and the anisotropic conductive film are disposed at the same side of the substrate, and the micro-LEDs are electrically connected to the substrate through the anisotropic conductive film. Each of the micro-LEDs includes an epitaxial layer and an electrode layer electrically connected to the epitaxial layer, and the electrode layers comprises a first electrode and a second electrode which are located between the substrate and the corresponding epitaxial layer. A ratio of a thickness of each of the electrode layers to a thickness of the corresponding epitaxial layer ranges from 0.1 to 0.5, and a gap between the first electrode and the second electrode of each of the micro-LEDs is in a range of 1 μm to 30 μm.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the priority benefit of Taiwan application serial no. 106137561, filed on Oct. 31, 2017. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.BACKGROUND OF THE INVENTIONField of the Invention[0002]The invention relates to a display panel and a manufacturing method thereof, and more particularly relates to a micro-LED (light-emitting diode) display panel and a manufacturing method thereof.Description of Related Art[0003]Micro-LED displays have advantages not only in low power consumption, high brightness, high color saturation, fast response, and power saving, but also in material stability and image sticking. Therefore, the development of the display technology of micro-LED displays has drawn much attention.[0004]In terms of the manufacturing process, in the process of transferring micro-LEDs from a growth substrate to a driving circu...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L25/16H01L25/075H01L33/62H01L33/38H01L23/00H01L33/00
CPCH01L33/62H01L24/95H01L25/167H01L24/32H01L25/0753H01L24/81H01L33/38H01L24/83H01L2224/2929H01L2924/12041H01L2224/83005H01L24/73H01L2224/32145H01L2924/10156H01L2224/83851H01L2224/83192H01L2224/1403H01L2224/29298H01L2224/73204H01L24/29H01L2224/81903H01L2224/95001H01L2924/00014H01L24/16H01L33/0093H01L24/14H01L2933/0066H01L2224/83203H01L2924/00012H01L2224/13099H01L2224/32225H01L2224/16225H01L2224/95136
Inventor LIU, YING-TSANGLI, YU-CHUCHEN, PEI-HSINCHEN, YI-CHING
Owner PLAYNITRIDE