Rubber plate used in an ion implanter and method of preparing the same

Abstract

The present invention provides a method and a set of trimming accessories for trimming rubber plate used in an ion implanter. The rubber plate is suitable for use in an ion implanter, wherein the ion implanter has a platform with multiple primary holes and multiple primary notches. In specific embodiments, the set of trimming accessories includes trimming equipment such as a knife or preferably a laser; a template with secondary holes corresponding to primary holes and secondary notches corresponding to primary notches. The template is used as a guide to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template. The trimmed rubber plate can then be placed on the platform so that the tertiary holes of the rubber plate match the primary holes of the platform and the tertiary notches of the rubber plate match the primary notches of the platform.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS [0001] This application claims priority from R.O.C. Patent Application No. 090105018, filed Mar. 5, 2001, the entire disclosure of which is incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] The present invention relates to a rubber plate used in an ion implanter, as well as the method and accessories for preparing the rubber plate. [0003] The ion implanter is a complex apparatus used in the manufacture of doped wafers. During the ion implantation process, wafers to be processed are placed on a platform within the load / unload system of the ion implanter. The present invention is related to a rubber plate disposed on top of this platform. [0004] The platform, represented as platform 10 in FIG. 1a, has primary notches 12 for the wafer pad to pass through and primary holes 11 for locating the platform 10. Wafers are not placed directly on top of the platform. Instead, a rubber plate 30 is placed between the wafer and the platfo...

AI Technical Summary

Benefits of technology

[0006] The present invention is directed to a method and accessories for trimming a rubber plate used in an ion implanter without the above drawbacks of the prior art. In specific embodiments, the rubber plate is trimmed prior to being placed on the platform using a template that matches the shape and features of the platform. The trimmed rubber plate is then placed on top of the platform. In this way, the problems of in situ trimming of the rubber plate are avoided so as to ensure the quality and efficiency of wafer production.

Problems solved by technology

However, this procedure tends to cause damage to the platform 10.

Also, the rubber plate 30 may peel off the platform 10 and cause uneven cooling of the wafers during ion implantation, which in turn leads to sticky or broken wafers.

Also, debris may be produced during the trimming process and hamper wafer production.

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