Method of packaging an optical sensor

Abstract

An image sensor device includes a first, QFN type leadframe to which a sensor IC is electrically connected. A second leadframe is provided for holding a lens. A third leadframe is positioned between the first and second leadframes to appropriately space the IC from the lens. Multiple sensor devices are assembled at the same time by the use of leadframe panels.

Description

BACKGROUND OF THE INVENTION [0001] The present invention relates to image and optical sensors and, more particularly, to a method of packaging an optical sensor and the resulting packaged sensor product. [0002] There has been a constant demand for smaller and smarter industrial and consumer electronic products such as digital cameras, camcorders, audio players, etc. Such miniaturization and increased functionality has benefited from advances in the design and manufacturing of semiconductor circuits and wafers. There has also been a marked increase in the use of optical and image sensors in electronic products. Such sensor devices are packaged in a variety of ways. For example, an optical sensor in a ceramic leadless chip carrier has good optical quality, but large package form factor. A wafer level package has a lesser form factor and good optical quality, but is very expensive. Image sensors are also available as a molded quad flat pack (QFP). While the QFP has a moderate cost, it ...

AI Technical Summary

Benefits of technology

This approach results in a packaged image sensor with low cost and high optical quality, enabling precise alignment of the optical axis with the image center, reducing defects and yield loss, and maintaining lens cleanliness.

Problems solved by technology

A wafer level package has a lesser form factor and good optical quality, but is very expensive.

While the QFP has a moderate cost, it has low optical quality and a large package form factor.

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