High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Abstract

A high frequency module device having a high frequency circuit block unit including a passive device. A plural number of unit wiring layers, each formed by an insulating layer, having a passive device unit in its portion, and by a pattern wiring, are layered on a dummy substrate, and are released from the dummy substrate to form the high frequency circuit block unit (2), which is mounted on a motherboard (3). The major surfaces of the respective unit wiring layers are planarized. The passive device unit and the pattern wiring, formed on the major surface of each unit wiring layer in the high frequency circuit block unit (2), can be formed with high accuracy to improve high frequency characteristics. The high frequency circuit block unit (2) is not in need of a base substrate, thus achieves reduction in size and cost.

Description

TECHNICAL FIELD [0001] This invention relates to a high frequency circuit block unit, having a passive device, a manufacturing method therefor, a high frequency module device having the high frequency circuit block unit mounted on a motherboard, and a manufacturing method therefor. [0002] This application claims priority of Japanese Patent: Application No. 2001-359853, filed on Nov. 26, 2001, the entirety of which is incorporated by reference herein. BACKGROUND ART [0003] A variety of the information, such as audio or video information, is converted into digital signals and handled as digital data, and hence may readily be handled by for example a personal computer or by a mobile computer. The above information may be compressed in bandwidth by an audio codec or video codec technology so as to be distributed by digital communication or digital broadcast to a variety of communication terminal equipment readily efficiently. For example, audio / video data (AV data) may be received outdo...

AI Technical Summary

Benefits of technology

The present invention provides a high frequency circuit block unit and a method for producing it that can overcome the problems of conventional high frequency module devices. The block unit has high precision and can be reduced in size and cost. The method includes layering a plurality of unit wiring layers on a release layer, planarizing the major surfaces of the wiring layers, and removing the dummy substrate and release layer to form the block unit. The high frequency module device includes the high frequency circuit block unit mounted on a motherboard. The technical effects of the invention are improved precision and reduced size and cost of the high frequency circuit block unit and module device.

Problems solved by technology

In the high frequency transmission / reception circuit 110, since the signals are amplified at a time in a high frequency stage, it becomes difficult to achieve a sufficient gain, so that the amplifying operation needs to be performed in the baseband unit.

Thus, the high frequency transmission / reception circuit 110 is in need of a circuit for canceling DC offset, or redundant low-pass filters, thus further increasing the overall power consumption.

The conventional high frequency transmission / reception circuit is not of sufficient characteristics to satisfy required specifications, such as reduction in size or weight of the communication terminal equipment, whether the circuit is of the superheterodyne type or the direct conversion type.

This high frequency circuit substrate suffers a problem that the inductor unit 120 has to be formed by numerous cumbersome process steps, thus raising the cost.

Moreover, in the high frequency circuit substrate, the electrical interference between the high frequency circuit section of the analog circuit and the baseband circuit section of the digital circuit poses a serious problem.

Thus, in the high frequency circuit substrates 130, 140, such problems may be produced as electrical interference across respective wirings, increased cost due to multi-layered wirings or bulkiness in size due to layout of the interconnections.

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