Spray deposition apparatus and methods for metal matrix composites

Abstract

A spray deposition apparatus comprises a source of aqueous fiber slurry that includes a mixture of milled graphite fibers in suspension. A slurry input of the spray deposition apparatus is coupled to the source of aqueous fiber slurry. The slurry input receives the mixture of aqueous fiber slurry. A gas pressure input receives pressurized gas. A nozzle aspirates the mixture of aqueous fiber slurry with the pressurized gas to produce a stream of fiber cluster droplets.

Description

BACKGROUND OF THE INVENTION [0001] The section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described in the present application. [0002] Modern electronic devices and systems, such as cellular phones, radar systems, high power RF and microwave devices and systems, and imaging systems push current semiconductor device capabilities to their performance limits. Increasing operating speeds and computing power of modern microelectronic devices have given rise to increases in complexity and functionality of the semiconductor structures. Such devices often must dissipate large amounts of heat during normal operation. Consequently, state-of-the art integrated circuit devices often require heat sinks to maintain acceptable operating temperatures. The semiconductor die can be directly attached to a heat sink or can be encased in a ceramic package that protects the die and provides electrical connections. [0003] Common cer...

AI Technical Summary

Problems solved by technology

Increasing operating speeds and computing power of modern microelectronic devices have given rise to increases in complexity and functionality of the semiconductor structures.

Such devices often must dissipate large amounts of heat during normal operation.

Consequently, state-of-the art integrated circuit devices often require heat sinks to maintain acceptable operating temperatures.

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