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Process for forming an electronic device including workpieces and a conductive member therebetween

a technology of workpieces and conductive components, applied in the direction of solid-state devices, semiconductor devices, organic semiconductor devices, etc., can solve the problems of non-functional or poorly functioning driver circuits, electrically connected operable driver circuits to non-functional or poorly functioning oleds, and the effect of reducing the service life of the operating driver circui

Inactive Publication Date: 2006-12-07
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0049] Other features and advantages of the invention will be apparent from the following detailed description, and from the claims. The detailed description first addresses Definitions and Clarification of Terms followed by the Exemplary Circuit Design, First Workpiece (Organic Panel) Fabrication, Second Workpiece (Back Panel) Fabrication, Aligning the First and Second Workpieces and Reflow, Electronic Device and Its Operation, Alternative Embodiments, Advantages, and finally Examples.

Problems solved by technology

Electronic circuits that are otherwise good may become effectively worthless during the fabrication of the OLEDs.
For example, a fabrication defect or error when forming the OLEDs can result in operable driver circuits that are electrically connected to non-functional or poorly functioning OLEDs.
In another example, fabrication of the OLEDs may render the driver circuits to be non-functional or poorly functioning due to processing conditions.
Such non-functional or poorly functioning driver circuits may result from temperature cycling, plasma damage, or the like.
Still further, the additional processing for the OLEDs increases the likelihood that a substrate will be dropped, fractured, misplaced, or combined with the wrong lot of substrates.
In all of these attempts, the electrical connection is achieved through physical pressure in which OLED pixels are liable to be damaged.
Therefore, these processes can actually reduce the yield and increase the fabrication cost.
Making micro vias for millions of pixels is a difficult process.

Method used

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  • Process for forming an electronic device including workpieces and a conductive member therebetween
  • Process for forming an electronic device including workpieces and a conductive member therebetween
  • Process for forming an electronic device including workpieces and a conductive member therebetween

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0203] Example 1 demonstrates that electrical connections between substrates can be formed using a reflow process. A two-substrate backlight is formed in this example.

[0204] Referring to FIG. 20, a first substrate 200 is glass with a layer 202 of ITO having a thickness of approximately 110 nm. A layer 204 of indium is thermally deposited (e.g. evaporating) on the surface of the ITO in a vacuum of approximately 1×10−6 Torr. The thickness of the indium layer is approximately 650 nm. After the indium layer is deposited, the first substrate 200 and another substrate 206, with a light-emitting organic layer (not illustrated) and a layer 208 of ITO (similar to the first substrate 200) but without the indium layer, are bonded together by a heat curable epoxy 209. An illustration of a cross-sectional view of the bonded substrates is illustrated in FIG. 20. The resistance between the two layers 202 and 208 at this point in the process is extremely high due to the gap between the indium laye...

example 2

[0205] Example 2 demonstrates that conductive members of indium can be formed that pull away from edges of ITO layers during a reflow process.

[0206] Two nominal 10 cm×10 cm substrates are used in this example. Each substrate is glass with 10 ITO strips, each having a thickness of approximately 110 nm and a width of approximately 350 microns. The distance between adjacent strips on each substrate is approximately 150 microns. On one substrate, a layer of indium is thermally deposited through a shadow mask onto the surface of the ITO strips in a vacuum of approximately 1×10−6 Torr. The thickness of the indium layer is approximately 650 nm. After the indium layer is deposited, the two substrates, one with the indium layer, the other one without the indium layer, are bonded together by heat curable epoxy. The ITO strips on each substrate are aligned to be perpendicular to each other. In that way, as seen from a top view, the overlapping area between two strips on separate substrates is...

example 3

[0207] Example 3 demonstrates that a passive matrix display and a backlight can be formed using a reflow process.

[0208] In Example 3, the workpiece includes a driving panel that is a backlight panel. An metallic alloy layer, including approximately 40 weight % In, 40 weight % Sn, and 20 weight % Pb, of approximately 1.5 microns thick is thermally deposited on top of ITO in a vacuum of less than approximately 1×10−6 Torr. The other workpiece includes an OLED panel that is a backlight panel with a passive matrix pixelated area with ITO as a common electrode (e.g., cathode). The pixelated area is made by forming negative photoresist banks. Since the height of the photoresist bank is approximately 3 microns, a gap of approximately 1 micron lies between the indium layer and the cathode of the OLED device during the panel bonding. The total pixel count is approximately 100×50, with pitch size of approximately 100 microns×300 microns. The openings of the photoresist bank for each pixel ar...

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PUM

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Abstract

A process for forming an electronic device can include providing a first workpiece including an electronic component that includes an electrode and an organic layer, and providing a second workpiece that includes a conductor. The process can also include reflowing a conductive member between the electrode and conductor. In one embodiment, after reflowing, the conductive member can have a width at a point about halfway between the first electrode and the conductor that is wider than a width of the conductive member at a point closer to the electrode or the conductor. In another embodiment, after reflowing, the conductive member can include a void. In still another embodiment, after reflowing, a conductive member can separate into a set of conductive members that lie between the electrode and the conductor.

Description

CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application claims the benefit of priority under 35 U.S.C. § 119(e) from provisional U.S. Application Ser. No. 60 / 687,350, filed Jun. 6, 2005, which is incorporated herein by reference in its entirety.BACKGROUND INFORMATION [0002] 1. Field of the Disclosure [0003] The present disclosure relates to processes for forming electronic devices, and more particularly to processes for forming electronic devices that include workpieces and conductive members therebetween. [0004] 2. Description of the Related Art [0005] Electronic devices, including organic electronic devices, continue to be more extensively used in everyday life. Examples of organic electronic devices include Organic Light-Emitting Diodes (“OLEDs”). Conventional OLED displays are typically formed from a single substrate. Whether passive matrix or active matrix, electronic circuits used to drive the OLEDs are formed before the OLEDs, themselves. Electronic circuits that are ...

Claims

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Application Information

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IPC IPC(8): H01L21/44
CPCH01L27/30H01L27/3211H01L27/3246H01L27/3253H01L27/3276Y02E10/549H01L51/0024H01L51/5212H01L51/5284H01L51/56H01L2251/568H01L51/0021H10K39/00H10K59/35H10K59/122H10K59/1275H10K59/131H10K71/60H10K71/50H10K71/861H10K59/80516H01L31/022475H10N30/095H01L2924/01049H10K50/814H10K50/865H10K71/00
Inventor WANG, JIANYU, GANG
Owner EI DU PONT DE NEMOURS & CO