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Built-in type upper/lower electrode multi-layer part and method of manufacturing thereof

a multi-layer part and upper/lower electrode technology, applied in the direction of fixed capacitors, stacked capacitors, fixed capacitor details, etc., can solve the problems of difficult to form an external electrode of the part, difficult to form the via hole, and difficult process elements and characteristics, so as to enhance the bending strength of the part

Inactive Publication Date: 2006-12-28
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0019] An advantage of the present invention is that it provides a built-in type upper / lower electrode multi-layer part, in which an area where internal electrode patterns of a plurality of laminated ceramic sheets overlap each other is formed to differ according to an electrostatic capacity so as to realize a desired band of electrostatic capacity, and a method of manufacturing the same.
[0020] Another advantage of the invention is that it provides a built-in type upper / lower electrode multi-layer part, in which a plurality of first and second ceramic sheets having a different internal electrode pattern from each other are alternately laminated so as to form a multi-layer sheet product, first and second via holes for respectively connecting the first and second ceramic sheets are formed, and via holes which are formed on ceramic sheets joined on the top and bottom surfaces of the multi-layer sheet product are formed to be larger than the first and second via holes, so that upper and lower external electrodes can be formed by only via holes without nickel layers being formed, and a method of manufacturing the same.
[0021] A further advantage of the invention is that it provides a built-in type upper / lower electrode multi-layer part, in which the external electrodes of the part are formed on the entire upper and lower portions or predetermined upper and lower portions so that the via holes are easily formed on a substrate, and a method of manufacturing the same.
[0022] A still further advantage of the invention is that it provides a built-in type upper / lower electrode multi-layer part, which is manufactured to have the same width and length as each other so that the number of punching and drilling processes for building the part into the substrate can be reduced to one time and the bending strength of the part can be enhanced.
[0023] Additional aspects and advantages of the present general inventive concept will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the general inventive concept.
[0024] According to an aspect of the invention, a method of manufacturing a built-in type upper / lower electrode multi-layer part includes alternately laminating a first ceramic sheet having a first internal electrode pattern formed thereon and a second ceramic sheet having a second internal electrode pattern formed thereon so as to form a first multi-layer sheet product; forming first and second via holes on the first multi-layer sheet product, the first and second via holes respectively connecting the first and second internal electrode patterns; respectively joining third and fourth ceramic sheets having no internal electrode pattern on the upper and lower portions of the first multi-layer sheet product so as to form a second multi-layer sheet product, the third and fourth ceramic sheets having third and fourth via holes formed to correspond to the first and second via holes; and filling a conductive paste in the first to fourth via holes.

Problems solved by technology

However, such integration and miniaturization are followed by various difficulties in process elements and characteristics.
In this case, the thickness of the part should be smaller than that of the substrate so that the part can be built into the substrate, which makes it difficult to form an external electrode of the part.
In the built-in type left / right electrode multi-layer part according to the related art, when the substrate is drilled to form a via hole for electrical connection, the precision as much as the width of the band of the external electrode should be secured so that the part is not opened, which makes it very difficult to form the via hole.
Furthermore, when a small-sized part is manufactured, a high-precision punching or drilling technique is required, which makes it harder to manufacture the part.
As such, if the left and right external electrodes are formed in a matchstick shape, the problems are caused in the connection with the internal electrode, and it is possible to manufacture a part having a desired thickness.

Method used

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  • Built-in type upper/lower electrode multi-layer part and method of manufacturing thereof
  • Built-in type upper/lower electrode multi-layer part and method of manufacturing thereof
  • Built-in type upper/lower electrode multi-layer part and method of manufacturing thereof

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Experimental program
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Effect test

first embodiment

[0066] [First Embodiment]

[0067]FIGS. 4A to 4G are diagrams explaining a process of manufacturing a built-in type upper / lower electrode multi-layer part according to a first embodiment of the present invention, and the procedure of the process is as follows.

[0068] Referring to FIG. 4A, a first internal electrode pattern 12a having a predetermined shape is formed on one side of a first ceramic sheet 10a, and a second internal electrode pattern 12b is formed on one side of a second ceramic sheet 10b. When the first and second ceramic sheets 10a and 10b are overlapped with each other, a portion of the first internal electrode pattern 10a overlaps a portion of the second internal electrode pattern 10b.

[0069] At this time, the first and second ceramic sheets 10a and 10b are formed in a square shape where the length and width are the same as each other. As shown in FIG. 4A, the first internal electrode pattern 12a is formed in a reverse L shape, and the second internal electrode pattern ...

second embodiment

[0088] [Second Embodiment]

[0089]FIGS. 5A to 5G are diagrams explaining a process of manufacturing a built-in type upper / lower electrode multi-layer part according to a second embodiment of the present invention, in which internal electrode patterns are implemented to have a different shape so that an area where internal electrode patterns overlap each other is different from that of the first embodiment.

[0090] As shown in FIG. 5A, the built-in type upper / lower electrode multi-layer part is formed so that a first internal electrode pattern 62a having a predetermined shape is formed on one side of a first ceramic sheet 60a and a second internal electrode pattern 62b is formed on one side of a second ceramic sheet 60b. When the first and second ceramic sheets 60a and 60b are overlapped with each other, a portion of the first electrode pattern 62a overlaps a portion of the second electrode pattern 62b.

[0091] The first and second ceramic sheets 60a and 60b are formed in a square shape ...

third embodiment

[0104] [Third Embodiment]

[0105]FIGS. 6A and 6B are diagrams explaining a process of manufacturing a built-in type upper / lower electrode multi-layer part according to a third embodiment of the present invention.

[0106] In the built-in type upper / lower electrode multi-layer part according to the third embodiment, an area where internal electrode patterns overlap each other when ceramic sheets are laminated is reduced to realize a low capacity band. The built-in type upper / lower electrode multi-layer part is manufactured almost the same as those of the first and second embodiments.

[0107] As described above, an electrostatic capacity differs according to an area where the internal electrode patterns overlap each other. Therefore, if the area where the internal electrode patterns overlap each other is reduced, a low capacity band can be realized.

[0108] The internal electrode patterns of the built-in type upper / lower electrode multi-layer part according to the third embodiment are forme...

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Abstract

The present invention relates to a method of manufacturing a built-in type upper / lower electrode multi-layer part including alternately laminating a first ceramic sheet having a first internal electrode pattern formed thereon and a second ceramic sheet having a second internal electrode pattern formed thereon so as to form a first multi-layer sheet product; forming first and second via holes on the first multi-layer sheet product, the first and second via holes respectively connecting the first and second internal electrode patterns; respectively joining third and fourth ceramic sheets having no internal electrode pattern on the upper and lower portions of the first multi-layer sheet product so as to form a second multi-layer sheet product, the third and fourth ceramic sheets having third and fourth via holes formed to correspond to the first and second via holes; and filling a conductive paste in the first to fourth via holes.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] The application claims the benefit of Korea Patent Application No. 2005-0053844 filed with the Korea Industrial Property Office on Jun. 22, 2005, the disclosure of which is incorporated herein by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a built-in type upper / lower electrode multi-layer part and a method of manufacturing the same, and more specifically, to a built-in type upper / lower electrode multi-layer part, in which an area where internal electrode patterns of a plurality of laminated ceramic sheets overlap each other is formed to differ according to an electrostatic capacity so as to realize a desired band of electrostatic capacity, and a method of manufacturing the same. [0004] Further, the present invention relates to a built-in type upper / lower electrode multi-layer part, in which upper and lower external electrodes can be formed by only via holes without any ...

Claims

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Application Information

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IPC IPC(8): H01G4/236H01G4/12H01G4/232H01G4/30
CPCH01G4/012H01G4/30H01G4/232H01G4/005
Inventor KANG, SUNG HYUNGAHN, JIN YONGCHO, SUK HYEONCHOI, YOUNG DONCHUNG, HAE SUKSHIM, CHANG HOON
Owner SAMSUNG ELECTRO MECHANICS CO LTD