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Light emitting diode module, backlight assembly and display device provided with the same

a technology of light emitting diodes and backlight assemblies, which is applied in the direction of sustainable manufacturing/processing, instruments, final product manufacturing, etc., can solve the problems of substantial heat generation, damage to light emitting diodes or display devices, etc., and achieve improved heat resistance and durability, and improved heat radiating efficiency

Inactive Publication Date: 2007-01-11
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a light emitting diode module with improved heat radiating efficiency, heat resistance, and durability. The module includes a printed circuit board with junction holes and light emitting diodes with a light emitting portion and a lead portion positioned in the junction hole. A junction member is filled in the junction hole to electrically connect the lead portion and the wiring layer. The printed circuit board may be a metal core printed circuit board made of aluminum. The module also includes a light diffusing member for diffusing the light emitted by the module. The invention also provides a backlight assembly and a display device including the light emitting diode module. The technical effects of the invention include improved heat dissipation, durability, and brightness of the light emitting diode module.

Problems solved by technology

However, when the light emitting diode is used as the light source, a substantial amount of heat is generated.
The generated heat, in turn, may damage the light emitting diode or the display device.

Method used

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  • Light emitting diode module, backlight assembly and display device provided with the same
  • Light emitting diode module, backlight assembly and display device provided with the same
  • Light emitting diode module, backlight assembly and display device provided with the same

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Embodiment Construction

[0057] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout.

[0058] It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present there between. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. As used herein, the term “and / or” includes any and all combinations of one or more of the...

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Abstract

The present invention relates to a light emitting diode module, as well as a backlight assembly and a display device including the same. The light emitting diode module according to an exemplary embodiment of the present invention includes a printed circuit board having a plurality of junction holes, a plurality of light emitting diodes having a light emitting portion for emitting light and a lead portion with one end electrically connected to the light emitting portion and the other end positioned in a corresponding junction hole, and a junction member filled in the corresponding junction hole in which the lead portion is positioned.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2005-0061803, filed on Jul. 08, 2005, and all the benefits accruing therefrom under 35 U.S.C. §119, the contents of which in its entirety are herein incorporated by reference. BACKGROUND OF THE INVENTION [0002] (a) Field of the Invention [0003] The present invention relates to a light emitting diode (“LED”) module, and a backlight assembly and a display device having the same. More particularly, the present invention relates to an LED module having characteristics of improved heat radiating efficiency, as well as improved thermal resistance and durability, and a backlight assembly and a display device having the same. [0004] (b) Description of the Related Art [0005] Among various display devices, a liquid crystal display (“LCD”) has become one of the most represented display devices. This is due in part because of the much improved performance of the LCD due to rapidly developing semiconductor technologies a...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L33/00H01L33/62F21V19/00F21V29/00F21Y101/02H01L33/64
CPCG02F1/133603G02F2001/133628H05K1/053H05K1/056H05K1/111H05K2201/10651H05K3/4611H05K2201/0394H05K2201/09472H05K2201/10106H05K3/3421G02F1/133628Y02P70/50
Inventor KIM, GI-CHERLLEE, SANG-YUYANG, BYUNG-CHOONSONG, CHUN-HOCHO, DON-CHAN
Owner SAMSUNG ELECTRONICS CO LTD
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