Exposure apparatus and method for producing device
a technology of exposure apparatus and producing device, which is applied in the direction of microlithography exposure apparatus, printers, instruments, etc., can solve the problems of insufficient margins, and difficulty in matching substrate surfaces with respect to the image plane of projection optical systems, etc., to achieve the effect of suppressing the deterioration of pattern images
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
Problems solved by technology
Method used
Image
Examples
first embodiment
[0038] With reference to FIG. 1, an exposure apparatus EX comprises a mask stage MST which supports a mask M, a substrate stage PST which supports a substrate P, an illumination optical system IL which illuminates, with an exposure light beam EL, the mask M supported by the mask stage MST, a projection optical system PL which performs projection exposure for the substrate P supported by the substrate stage PST with an image of a pattern of the mask M illuminated with the exposure light beam EL, and a control unit CONT which collectively controls the overall operation of the exposure apparatus EX.
[0039] The embodiment of the present invention will now be explained as exemplified by a case of the use of the scanning type exposure apparatus (so-called scanning stepper) as the exposure apparatus EX in which the substrate P is exposed with the pattern formed on the mask M while synchronously moving the mask M and the substrate P in mutually different directions (opposite directions) in ...
second embodiment
[0066] Next, an explanation will be made with reference to FIG. 5 about a second embodiment of the exposure apparatus EX of the present invention. In the following description, the same or equivalent constitutive parts as those of the embodiment described above are designated by the same reference numerals, any explanation of which is simplified or omitted. The characteristic feature of this embodiment is that a pressure-reducing unit 23 is provided in place of the heating unit 21.
[0067] As shown in FIG. 5, the liquid supply unit 1 includes a filter 20 which removes any foreign matter from the liquid 50, for example, by filtering the liquid 50 recovered by the liquid recovery unit 2 in order to avoid any pollution of the substrate P and the projection optical system PL and / or avoid any deterioration of the pattern image projected onto the substrate P, the pressure-reducing unit 23 which degasses the liquid 50 by reducing the pressure of the liquid 50 from which the foreign matter h...
third embodiment
[0073] An explanation will be made with reference to FIGS. 6 and 7 about a third embodiment of the exposure apparatus EX of the present invention. The exposure apparatus of this embodiment is provided with a membrane degassing unit 24 and a heating unit 25 as shown in FIG. 6 in place of the heating unit of the liquid supply unit in the first embodiment. In the following description, the same or equivalent constitutive parts as those of the embodiment described above are designated by the same reference numerals, any explanation of which is simplified or omitted.
[0074]FIG. 6 shows an arrangement of the liquid supply unit 1. As shown in FIG. 6, the liquid supply unit 1 includes a filter 20 which removes any foreign matter or the like from the liquid 50 recovered by the liquid recovery unit 2, for example, by filtering the liquid 50 recovered by the liquid recovery unit 2 in order to avoid any pollution of the substrate P and the projection optical system PL and / or avoid any deteriora...
PUM
Property | Measurement | Unit |
---|---|---|
refractive index | aaaaa | aaaaa |
temperature | aaaaa | aaaaa |
wavelength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com